Fujitsu Corporation

Nobumitsu Aoki

Hideo Kubo

Yoshinori Uzuka

Tsuyoshi So

Keita Hirai

Osamu Aizawa

Takashi Urai

Koji Nakagawa

Masumi Suzuki

Nobuyuki Hayashi

Teru Nakanishi

Michimasa Aoki

Takeshi Nishiyama

Jie Wei

Fumihiro Tawa

Naofumi Kosugi

Atsushi Endo

Kenji Sasabe

Shinnosuke Fujiwara

Jun Taniguchi

Masahide Kodama

Kento Ohga

A cooling device includes: a container in which a refrigerant is sealed; an evaporating part that evaporates the refrigerant in a liquid phase by heat reception inside the container; a condensing part that condenses the refrigerant in a gas phase by heat dissipation inside the container; and a plate-shaped or block-shaped flow path member in which a plurality of flow paths configured to transport the refrigerant in a liquid phase from the condensing part to the evaporating part by surface tension inside the container is formed in parallel.

Cooling device

A cooling apparatus includes an immersion-tank configured to store a refrigerant, a refrigerant suction port formed at a lower portion of the immersion-tank, the refrigerant suction port being configured to suck the refrigerant from an outside of the immersion-tank into an inside of the immersion-tank, an electronic device immersed in the refrigerant, the electronic device including, a first heat-generation portion, a second heat-generation portion having a heat-generation amount smaller than a heat-generation amount of the first heat-generation portion, and a refrigerant inlet positioned below the first heat-generation portion and the second heat-generation portion and being open downward, and a block positioned below the first heat-generation portion and the second heat-generation portion, the block including a through-hole through which a region positioned below the first heat-generation portion in the refrigerant inlet is open, and a closing portion that closes a region positioned below the second heat-generation portion in the refrigerant inlet.

Cooling apparatus

An information processing apparatus includes a plurality of electronic apparatus stacked over a plurality of hierarchies in the information processing apparatus, a heat exchanger that cools refrigerant liquid for cooling the plurality of electronic apparatus, a first distributor that distributes the refrigerant liquid from the heat exchanger to the plurality of hierarchies, a plurality of second distributor that stores the refrigerant liquid temporarily, and a plurality of pipes that branched from the distribution pipes to the plurality of the electronic apparatus, wherein the number of the second distributor increases toward a hierarchy on downstream side, the pipes of the last hierarchy are coupled to the electronic apparatus.

Information processing apparatus

A rack mount-type information processing apparatus includes: a plurality of slots, into each of which an electronic device is inserted, a liquid-cooled element provided in a cooling target included in the electronic device, a liquid to cool the cooling target being circulated in the liquid-cooled element; a manifold pipe extending in a direction where the slots are arranged; and a plurality of connection pipes configured to interconnect the liquid-cooled element and the manifold pipe, and coupled in parallel to the manifold pipe at a portion of the manifold pipe which corresponds to at least one slot among the plurality of slots.

Rack mount-type information processing apparatus and rack mount-type information processing system

A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.

Cooling device and electronic equipment

A liquid loop cooling apparatus includes: an evaporator thermally coupled to a heating element; a condenser configured to be cooled by an airflow; a pump configured to circulate a refrigerant between the evaporator and the condenser; a first piping configured to couple the evaporator and the condenser; a second piping configured to couple the condenser and the pump; and a third piping configured to couple the pump and the evaporator, wherein the first piping is arranged on a destination side of the airflow, and the second piping is arranged on a source side of the airflow.

Liquid loop cooling apparatus, electronic instrument, and method for manufacturing liquid loop cooling apparatus

A disclosed method of joining a cooling component includes joining an electronic component and a spherical shaped bottom plate of a cooling component to each other by pressing the bottom plate against the electronic component, while providing a thermal bonding material between the bottom plate and the electronic component.

Method of joining cooling component

A cooling unit includes a radiator, a rigid supply pipe connected to the radiator, and a refrigerant that is air-cooled by the radiator flows, a plurality of open nozzles provided at the supply pipe to correspond to the respective plurality of heat-generating components, a plurality of heat receiving units that are mounted to the respective plurality of heat-generating components and connected to the respective open nozzles, and allow a refrigerant supplied from the open nozzles to flow through internal channels, and a plurality of return pipes each of which is provided for each of the heat receiving units and joined to the heat receiving unit, and returns the refrigerant discharged from the heat receiving unit to the radiator, wherein the respective heat receiving units are connected to the supply pipe to be relatively displaceable, and the respective return pipes are connected to one another in series and relatively displaceably.

Cooling unit and electronic equipment

DIMMs to be cooled are mounted in DIMM areas of a printed circuit board of a system board. An air intake port that introduces cooling air is arranged on a side plate of the system board, whereas an air discharge port that discharges the cooling air is arranged on another side plate. The cooling air flows in a direction that is oblique with respect to the side plate. The air intake port is arranged at a position that is offset in the direction in which the cooling air is supplied. Accordingly, cooling is possible by efficiently bringing the cooling air into contact with the DIMMs.

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Kawasaki, Japan

Nobumitsu Aoki