Murata Manufacturing Co., Ltd.

Semiconductor Energy Laboratory Co., Ltd.

Murata Manufacturingco., Ltd.

Nobumitsu Amachi

Naoya Sakamoto

Mitsunori Sakama

Takeshi Fukada

Kazushige Sato

Shunpei Yamazaki

Mitsufumi Codama

Shigenori Hayashi

Takashi Inushima

Tetsu Nishimura

Shingo Funakawa

Hisato Shinohara

Ichiro Takayama

Masahiro Izawa

Katsuhiko Fujikawa

Masayuki Kobayashi

Takashi Inuzima

Takayuki Horibe

Yuya Eshita

Toru Takayama

Toshiji Hamatani

Koichi Sakamoto

Takahiro Okada

Michiharu Yokoyama

Takeshi Sato

Yuichi Ito

Ken Okada

Kenji Hayashikoshi

Yoshikazu Yagi

Noboru Morioka

Shinya Harada

Mitsuhiro Tsuchioka

Takeshi Fukuda

Akihiro Hara

Shigeyuki Kamio

Yasushi Yamamoto

Toshihiro Hosokawa

Atsuto Komoda

Suguya Ibaraki

Takafumi Kanno

Hisaki Honjo

Yuki Maruno

Mitsunri Sakama

Takashi Fuki

Jun Kashirajima

Yuko Aisaka

Kaneo Nomiyama

Ryuhei Nakai

Koudai Yokote

Hiroyuki Niwa

Takuya Kidera

A circuit module () includes a circuit board () having a main surface (), an electronic component () mounted on the main surface (), and a sealing resin () covering at least part of the electronic component () on the main surface (). A recess () is formed on at least part of a side surface () of the sealing resin (). At least the recess () is covered with an electrically conductive film ().

Circuit module and manufacturing method therefor

A circuit module () includes a substrate (), on one principal surface of which a first wiring pattern () is provided, first electronic components (-) constituting a first electronic circuit together with the first wiring pattern (), a plurality of connection conductors (), a plurality of external connection terminals, a first resin layer (), and a second resin layer (). At least one of the plurality of connection conductors () includes a first columnar conductor () extending in a normal line direction of the one principal surface of the substrate (), and a plate-like conductor () extending in a direction parallel to the one principal surface of the substrate (). At least one of the plurality of external connection terminals is a second columnar conductor () extending in the normal line direction of the one principal surface of the substrate ().

Circuit module and manufacturing method for circuit module

An antenna () includes a grounded conductive foil () disposed on a module substrate (), a first conductive foil (), and a second conductive foil (). The first conductive foil () and the second conductive foil () are disposed on the module substrate (), are elongated, and do not overlap with the grounded conductive foil () in a plan view of the module substrate (). The first conductive foil () has one end supplied with an antenna signal and the other end that is open. The second conductive foil () has one end connected to the grounded conductive foil () and the other end that is open. A wireless module () includes a circuit unit () including a communication circuit and provided to the module substrate () on which the antenna () is formed.

Antenna and wireless module

A location estimation system includes non-directional stationary devices having respective non-directional antennas configured to receive a radio signal transmitted by a mobile device; and directional stationary devices having respective directional antennas configured to receive a radio signal transmitted by the mobile device. The non-directional stationary devices output, as pieces of location estimation information for estimating a location of the mobile device, pieces of information indicating received signal strength indicators of the received radio signal. The directional stationary devices output, as pieces of complementary information for identifying a non-directional stationary device used for location estimation from among the non-directional stationary devices, pieces of information indicating received signal strength indicators of the received radio signal.

Location estimation system and location estimation method

A circuit module includes a flat substrate, a frame substrate, a first electronic component, and a first sealing member. First connection electrodes are disposed at a peripheral portion of one main surface of the flat substrate. Second connection electrodes are disposed on one main surface of the frame substrate at locations corresponding to the first connection electrodes. Each of the first connection electrodes and a corresponding one of the second connection electrodes are connected to each other via a first connection member. The first electronic component is sealed by the first sealing member. The first electronic component and the first sealing member are disposed in a cavity defined by the one main surface of the flat substrate and an inner surface of the frame substrate. The first sealing member is separated from the inner surface of the frame substrate.

A base part () has one main surface () that is spherically curved so as to protrude outward and another main surface () that is flat. A plurality of antenna elements () are provided along the one main surface () inside the base part (). A plurality of connection wiring lines () connect the plurality of connection terminals () and the plurality of antenna elements () to each other. A part of each of the plurality of connection wiring lines () disposed in a region where a ground wiring line () is provided extends in a direction perpendicular to the other main surface () when viewed in a direction perpendicular to the other main surface ().

Antenna module

A circuit module includes: a substrate including a wiring pattern; a first region in which a first electronic component is mounted on one major surface of the substrate; a second region in which a second electronic component, which is taller than the first electronic component, is mainly mounted on the one major surface of the substrate; a first conductor provided in the first region and electrically connected with the wiring pattern; and sealing resin that seals the first electronic component, the second electronic component, and the first conductor. Sealing resin sealing the first region is formed to be shorter than sealing resin sealing the second region, part of the first conductor is exposed on a surface of the sealing resin, wiring is formed on the surface of the sealing resin, and the first conductor the part of which is exposed is electrically connected with the wiring.

Circuit module

A position estimation system () includes: a plurality of fixed stations (-) installed inside a building, the plurality of fixed stations (-) each measuring the signal strength of a radio signal transmitted from a mobile object (); and a calculator configured to estimate a position of the mobile object () based on the signal strengths measured at the plurality of fixed stations (-), wherein each of the plurality of fixed stations (-) is installed in such a position that a distance to a top part of the mobile object () is equal to or less than a predetermined distance when the mobile object () is directly below the fixed station (-).

Position estimation system and position estimation method

A circuit module () includes a substrate () having a principal surface (), a first component () mounted on the principal surface (), and a sealing resin portion () that covers at least a side surface of the first component () while covering the principal surface (). The first component () includes an empty portion () and a connection portion () exposed to the empty portion (). The sealing resin portion () is arranged to avoid at least a part of a region that is included in an upper surface of the first component () and corresponds to the empty portion ().

A lighting system serving as a wireless network system includes a plurality of lighting appliances, which are a plurality of wireless devices, that each have unique identifier and transmit/receive a radio signal. Under control performed by a lighting controller, an operation is sequentially performed with respect to each of the plurality of lighting appliances in which one lighting appliance from among the plurality of lighting appliances broadcasts a measurement signal that includes the identifier of that lighting appliance and the other lighting appliances receive the measurement signal and measure reception quality, which depends on the distance between the lighting appliances.

Wireless network system and reception quality measurement method

A high-frequency component includes a wiring substrate, a component mounted on an upper surface of the wiring substrate, a columnar member formed of a conductive resin and standing on the upper surface of the wiring substrate in a state of a lower end portion of the columnar member being fixed to the upper surface of the wiring substrate, and a shield case covering the component and the columnar member. The shield case has a lid plate disposed so as to face the upper surface of the wiring substrate and a side plate extending from an edge of the lid plate toward the upper surface of the wiring substrate, and an upper end portion of the columnar member is fixed to each of four corner portions of the lid plate, when viewed in a direction perpendicular to the upper surface of the wiring substrate.

High-frequency component provided with a shield case

A circuit module () includes a first substrate (), a first module (), a sealing resin portion (), and a conductive material film (). The first substrate () has a first principal surface (). The first module () is mounted on the first principal surface (). The sealing resin portion () is formed on the first principal surface () and covers the first module (). The conductive material film () covers a side of the sealing resin portion (). The first module () includes a conductive material portion and a device which may produce heat and which is mounted on the conductive material portion. The conductive material portion connects with the conductive material film () on the side of the sealing resin portion ().

Circuit module and method of manufacturing the same

A position detection system includes a transmitter that transmits a first beacon signal with a first strength and at a first incidence and that transmits a second beacon signal with a second strength, which is greater than the first strength, and at a second incidence, which is lower than the first incidence, a plurality of receivers that are installed at known positions different from each other and that measure signal strengths of the first beacon signal and the second beacon signal, and a calculator that performs first processing in which the position of the transmitter is detected on the basis of a signal strength of the first beacon signal measured by one of the receivers and second processing in which the position of the transmitter is detected on the basis of signal strengths of the second beacon signal measured by two or more of the receivers.

Position detection system

A data sequence to be transmitted is constituted by a data body and preceding data. The amount of preceding data is smaller than that of data body. If it is determined as a result of executing carrier sensing that a frequency band of radio waves to be transmitted is not being used by another contending communication system, the preceding data is transmitted after the lapse of a predetermined time. If it is determined as a result of executing carrier sensing after completion of transmitting of the preceding data that the frequency band is not being used by another contending communication system, the data body is transmitted after the lapse of a predetermined time. If it is determined that the frequency band is being used, the contention for the frequency band is avoided.

Wireless communication device and wireless communication method using a carrier sensing technique

An antenna element includes an antenna board, a radiation conductor including radiation portions including a top surface portion and being divided at positions corresponding to frequency bands and provided with respect to a first feeding point in plan view of the antenna board, through-conductors penetrating the antenna board at respective positions of end portions of the top surface portion in a thickness direction, and bottom surface electrodes provided on a bottom surface of the antenna board opposite the end portions of the top surface portion, and connected to the top surface portion via the through-conductors.

Antenna element, antenna unit and communication module

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Kyoto, Japan

Nobumitsu Amachi