Sharp Kabushiki Kaisha Corporation

Nobumasa Kaneko

Kazunori Matsubara

Ayumi Yagi

Hideshi Koizumi

Shigehiro Yamada

Takashi Itoh

Kenichi Kurita

A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Semiconductor light emitting apparatus and method for producing the same

An optical pick-up apparatus and a semiconductor laser apparatus which can suppress reduction of optical utilization efficiency for the laser light emitted from the semiconductor laser element. When a laser light which is emitted from a laser element for DVD and whose polarization direction is perpendicular to a direction of a groove of the polarization grating is incident on the polarization grating, the polarization grating does not diffract the laser light and transmits the laser light as zero-order diffraction light. Consequently, all of the laser light emitted from the laser element for DVD can be used for reading information signal of DVD and detecting FES and TES. This enables reduction of optical utilization efficiency arising by diffracting action of a grating used for detecting TES of CD in a conventional optical pick-up apparatus to be suppressed.

Optical pick-up apparatus and semiconductor laser apparatus

A semiconductor laser device, with which a compact and thin optical pickup can be realized, is provided. On the top surface of a supporting member, there is formed an element mounting area for mounting a series of elements including a semiconductor laser element, and a light detecting element which detects a laser beam emitted from the semiconductor laser element and reflected by a surface of an outside optical disc so as to be re-entered. An optical path from the semiconductor laser element to the surface of the optical disc includes a vertical optical path advancing from the element mounting area of the supporting member in an approximately vertical upward direction. On a pair of right and left opposing ends of the supporting member, arcuate curved outer surfaces are formed, respectively, so as to fit the supporting member into an installation hole, for a semiconductor laser device, having arcuate curved inner surfaces. These curved outer surfaces are formed of arcs having the vertical optical path as the central axes, and are so formed that the curvature radiuses of the right and left arcs are different.

Growing community of inventors

Nara, Japan

Nobumasa Kaneko