Maruwa Corporation

Seiko Instruments Inc

Toray Advanced Film Co., Ltd.

Nobukazu Koizumi

Tsutomu Matsuhira

Keiichiro Hayashi

Tadahiro Nishigawa

Hideaki Adachi

This printed wiring board manufacturing method comprises the steps of providing a large number of through holes (for a through-hole) in a substrate made of an insulating material of which both sides are coated with a copper foil; making the inside of the through holes electrically conductive, coating the substrate with a photosensitive dry film, and developing and hardening the photosensitive dry film as a plating resist; and copper-plating the inside of the through holes and the opening periphery thereof. The manufacturing method further comprises the steps of coating the copper-plated area with a metal protective film, eliminating the photosensitive dry film; forming a circuit pattern; and conducting an overlaying treatment as a post-processing step.

Printed wiring board manufacturing method

In a method of manufacturing an electric device, moisture in a film substrate is reduced by heating the film substrate at a temperature in the range of 80&#xb0; C. to 100&#xb0; C. Thereafter, an IC is mounted on the film substrate.

Method of manufacturing electric device

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Fujisawa, Japan

Nobukazu Koizumi