Mitsui Toatsu Chemicals, Incorporated

Mitsui Chemicals, Inc.

Nobuhito Koga

Motoo Kawamata

Masayuki Oba

Hikotada Tsuboi

Akihiro Yamaguchi

Masahiro Ohta

Norimasa Yamaya

Toshiyuki Nakakura

Hideaki Oikawa

Toshihiko Tsutsumi

Shuichi Morikawa

Shoji Tamai

Toshiaki Takahashi

Yoshihisa Gotoh

Atsushi Morita

Kenichi Baba

Hiroyasu Oochi

Katsunori Shimamura

Kayako Ito

Masaki Amano

Tadashi Asanuma

Saburo Kawashima

Yuichi Okawa

Kazuhiko Ohkubo

Shinsuke Matsumoto

Tomoki Tsutsui

Taizo Nagahiro

Atsushi Miyata

Shuithi Morikawa

Toshihiko Isutsumi

Katsuaki Liyama

Highly-functionalized, low-viscosity polyether polyols are obtained by dehydration condensation reaction of alcohols. The polyether polyols are obtained by dehydration condensation of glycerin and monohydric and/or dihydric alcohol with the glycerin percentage being more than 50 mol % relative to 100 mol % of the total of the glycerin and alcohol. The glycerin may be crude glycerin obtained by hydrolysis or alcoholysis of natural fat and oils.

Polyether polyol, rigid polyurethane foam and processes for production thereof

A molding resin composition comprising 99.9 to 50% by weight of polyimide represented by the formula: ##STR1## and 0.1 to 50% by weight of polyether ketone resin and/or polyester resin, and more particularly comprising the polyester resin capable of forming an anisotropical molten phase at a temperature of 420.degree. C. or less, and a polyimide-based molding resin composition which comprises the said resins and other additives such as phenolic resin, fluororesin, graphite, carbon fibers, aromatic polyamide fibers, potassium titanate fibers and a crystallization accelerator, and is excellent in thermal resistance, chemical resistance, mechanical strength and processability.

Polyimide based resin composition comprising cured phenolic resins and

A thermoplastic resin composition comprise 99.9.about.50 parts by weight of one or more thermoplastic resin selected from the group consisting of aromatic polyimide, aromatic polyetherimide, aromatic polyamideimide, aromatic polyethersulfone and aromatic polyether ketone and 0.1.about.50 parts by weight of one or more liquid crystal type aromatic polyimide having recurring structural units represented by the formula (1): ##STR1## wherein R.sub.1 .about.R.sub.5 is a hydrogen atom, fluorine atom, trifluoromethyl, methyl, ethyl or cyano and may be the same or different, and R is a tetravalent radical having 6.about.27 carbon atoms and being selected from the group consisting of a monoaromatic radical, condensed polyaromatic radical and noncondensed aromatic radical connected each other with a direct bond or a bridge member. The present invention can provide thermoplastic resin compositions which have remarkably good processability and excellent thermal stability in addition to essentially excellent properties of each resin.

Polyimide composition

Polyimide based resin composition

A thermally stable polyimide which is blocked at the polymer terminal with a dicarboxylic acid anhydride represented by the formula (III): ##STR1## wherein Z is a divalent radical selected from the group consisting of a monoaromatic radical which is substantially unsubstituted or substituted with a radical having no reactivity with amine or dicarboxylic acid anhydride and has from 6 to 15 carbon atoms, a condensed polyaromatic radical or a noncondensed aromatic radical connected each other with a direct bond or a bridge member, and has a fundamental skeleton represented by recurring structural units of the formula (IV): ##STR2## and a process of preparing the polyimide.

Thermally stable polyimide and preparation process of polyimide

Integrated circuit sockets for use in a burn-in test are disclosed. The IC sockets are produced by injection molding of a specific polyimide having an inherent viscosity of 0.35 to 0.65 dl/g and essentially consisting of recurring units represented by the formula (I): ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon having from 1 to 10 carbon atoms, etc. and R is a tetravalent radical selected from the group consisting of an aliphatic radical having two or more carbon atoms, cycloaliphatic radical, monoaromatic radical etc.

Integrated circuit socket comprising a polyimide polymer

Provided are carbon-fiber-reinforced polyimide resin compositions having excellent mechanical strength. The compositions are formed of (a) 5-50 parts by weight of carbon fibers, which have been obtained by coating starting carbon fibers at surfaces thereof with an aromatic polysulfone resin and then heating the thus-coated carbon fibers at 300.degree.-400.degree. C., and (b) 95-50 parts by weight of a polyimide resin which perferably have recurring units of following formula: ##STR1## wherein X represents a specific divalent radical and R represents a particular tetra-valent radical.

Carbon-fiber-reinforced polyimide resin compositions

Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, impact strength, flexibility and high-temperature stability.

Thermosetting resin compostion from bis, maleimide and bis (meta-amino

Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula ##STR1## wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): ##STR2## and successively imidizing the resultant polyamic acid. Examples of the ether diamine used for preparing the polyamide include,

Polyimide

Polyimide resin composition

Thermosetting resin compositions are provided which comprise aromatic bismaleimide derivatives, for example, 2,2-bis[4(3-maleimidephenoxy)phenyl]propane and diamine derivatives, for example, 4,4'-bis(3-aminophenoxy)biphenyl. Prepolymers are also prepared by conducting heat-treatment of said compositions. The compositions of this invention are used for thermoforming such as compression molding etc. as well as raw materials of adhesives and coatings. The compositions provide molded articles which are excellent, for example, in impact strength, flexibility and high-temperature stability.

Thermosetting resin composition from poly-arylene-oxy-bis-maleimide and

This invention is a polyimide resin composition containing 100 parts by weight of polyimide having recurring units of the following formula: ##STR1## wherein Y is a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, thio radical, sulfinyl radical, sulfonyl radical or oxide, and R is a tetravalent radical of aliphatic radical having at least 2 carbons, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, or noncondensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function and from 5 to 100 parts by weight of fluororesin. The resin composition can provide molded products which are excellent in high-temperature stability, dimensional stability and mechanical strength and moreover have a low friction coefficient and good wear resistance. Therefore, the composition is useful as the material for electric and electronic devices, precision instrument parts etc. Polyimide of this invention can be prepared from aromatic diamines and tetracarboxylic acid dianydrides. Suitable aromatic diamines are 4,4'-bis(3-aminophenoxy)biphenyl, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, bis[4-(3aminophenoxy)phenyl] sulfide etc. Suitable tetracarboxylic acid dianhydrides are pyromellitic dianhydride and 3,3', 4,4'-benzophenonetetracarboxylic dianhydride. Representative fluororesin which can be used in this invention is polytetrafluoroethylene.

Polyimide resin-fluoropolymer compositions

Disclosed is a curable resin composition comprising (a) at least one maleimide compound selected from the group consisting of N-(alkenylphenyl)maleimide derivatives, and dimers and polymers thereof and (b) one or more kinds of epoxy resins, each having at least one epoxy group in the unit molecule thereof. The resin composition may contain, besides the above two components, an amino compound as a further component (c). The resin composition may comprise a prepolymer of any two components among the three components (a), (b) and (c) and the remaining component. The resin compositions are useful as molding materials, for the fabrication of laminates, and as varnishes, including insulation varnishes and impregnating varnishes.

Curable resin composition comprising N-(alkenylphenyl)maleimide, epoxy

Disclosed are novel alkenylphenylmaleimide derivatives having the general formula ##STR1## where R is an alkenyl radical of from 3 to 12 carbon atoms, R' is a hydrogen atom, a halogen atom, or a straight-chain or branched alkyl radical of from 1 to 4 carbon atoms, and n is a whole number of from 1 to 4, and linear dimers thereof as well as a process for the preparation of such maleimide compounds.

Process for the preparation of N-alkenylphenylmaleimides and

Curable resin composition comprising N-(alkenylphenyl)maleimide and

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Yokohama, Japan

Nobuhito Koga