Taiyo Ink Mfg. Co., Ltd.

Taiyo Holdings Co., Ltd.

Showa Denko K.k.

Nobuhito Ito

Masao Arima

Shoji Minegishi

Arata Endo

Daichi Okamoto

Masayuki Kobayashi

Atsushi Sakamoto

Kazuyoshi Yoneda

Syouji Nishiguchi

Kouji Ogawa

Provided is a photosensitive dry film capable of forming a solder resist layer that has an excellent filling property of underfill and that exhibits an excellent adhesion with a mold material. The photosensitive dry film according to the present invention is a photosensitive dry film including a supporting film and a photosensitive resin layer provided on one side of the supporting film, wherein the arithmetic average surface roughness Ra of the side of the supporting film on which the photosensitive resin layer is provided is 50 to 390 nm.

Photosensitive dry film and process for producing printed wiring board using the same

Provided is an alkali-developable photocurable/thermosetting resin composition from which a cured coating film that has excellent thermal shock resistance and exhibits excellent PCT resistance, HAST resistance and electroless gold plating resistance, which are important as a solder resist for semiconductor packages, can be formed. The alkali-developable photocurable/thermosetting resin composition is characterized by comprising (A) a carboxyl group-containing photosensitive resin, (B) a photopolymerization initiator, (C) a block copolymer and (D) a thermosetting component.

Photocurable/thermosetting resin composition

Provided are: a thermosetting resin composition in which a cured product is excellent in low warp properties, thermal cycle characteristics, and the like, and occurrence of cracking of a coating film in a B-stage state is suppressed; a cured product thereof; and a printed wiring board in which the cured product is used. The thermosetting resin composition comprises: (A) an epoxy resin; (B) a curing agent for an epoxy resin; (C) spherical silicon dioxide and/or spherical aluminum oxide; and (D) a block copolymer.

Thermosetting resin composition, cured product thereof, and printed wiring board using the same

An alkali-developable photosensitive resin composition comprises a carboxyl group-containing urethane resin having a biphenyl novolak structure, a photopolymerization initiator, and aluminum hydroxide and/or a phosphorus-containing compound. The composition may be formulated as a photocurable and thermosetting resin composition by further incorporating therein a thermosetting component having a plurality of cyclic ether groups and/or cyclic thioether groups in the molecule, besides the components described above. The photosensitive resin composition may further contain a colorant. By using the photosensitive resin composition or a dry film thereof, a printed wiring board having a flame-retardant cured film, such as a solder resist, formed from the halogen-free composition can be provided while imposing little burden on the environment, the cured film being flame-retardant and reduced in warpage and having various excellent properties including bending characteristics, resistance to soldering heat, and resistance to gold plating.

Photosensitive resin composition, dry film thereof, and printed wiring board using them

A carboxyl group-containing photosensitive resin is obtained by reacting an &#x3b1;,&#x3b2;-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein Rrepresents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SOgroup, an oxygen atom and sulfur atom, Rrepresents a hydrocarbon radical of 1 to 11 carbon atoms, 'a' represents an integer of 0 to 3, 'n' represents an integer of 1 to 2, and &#x201c;m&#x201d; represents an integer of 1 to 10.

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Hiki-gun, Japan

Nobuhito Ito