Sanyo Electric Co., Ltd.

Kanto Sanyo Semiconductors Co., Ltd.

Nobuhisa Takakusaki

Yusuke Igarashi

Noriaki Sakamoto

Ryosuke Usui

Hideki Mizuhara

Takeshi Nakamura

Jun Sakano

Yasunori Inoue

Yasuhiro Kohara

Hajime Kobayashi

Toshimichi Naruse

Masahiko Mizutani

Mitsuru Noguchi

Ryosuke Usul

Hayato Abe

A method for manufacturing a circuit device, which is suitable for connecting a plurality of laminated wiring layers to each other through an insulating layer, is provided. In a method for manufacturing a hybrid integrated circuit device of the present invention, a first wring layer is formed by laminating a first conductive film on a first insulating layer, and patterning the first conductive film. In the first wiring layer, a first connection part which is protruded in a thickness direction is formed. Moreover, the first wiring layer including the first connection part is covered with a second insulating layer. The second insulating layer is formed of a first resin film and a second resin film. The second resin film contains fewer inorganic fillers than the first resin film. Thus, there is an advantage that a through-hole can be easily formed.

Method for manufacturing circuit device

In a manufacturing method of a hybrid integrated circuit deviceaccording to the present invention, a first dummy pattern Dis provided on a first wiring layerA. Furthermore, a second dummy pattern Dis provided on a second wiring layerB. The first dummy pattern Dand the second dummy pattern Dare connected through a connection partwhich penetrates an insulation layer. Hence, heat dissipation through a dummy pattern can be actively performed. In addition, even in the cases where a multi-layered wiring is formed, it is possible to provide a circuit device which can secure a heat dissipation property.

Circuit device with dummy elements

An object of the present invention is to provide a method of manufacturing a hybrid integrated circuit device, in which multiple circuit boards are manufactured from one large metal board by dicing. The hybrid integrated circuit device of the present invention includes a circuit board with a surface provided with an insulating layer, and conductive patterns provided on the insulating layer. Circuit elements are electrically connected to the conductive patterns. Further, each side surface of the circuit board includes a first inclined portion extending obliquely downward from a peripheral portion of the surface of the circuit board, and a second inclined portion extending obliquely upward from a back surface of the circuit board and formed to be larger than the first inclined portion.

Hybrid integrated circuit device and method of manufacturing the same

In order to prevent short-circuiting when a chip component is brazed to pads of a conductive wiring layer, a hybrid semiconductor circuit includes the chip component with terminal electrodes formed at both ends, a first conductive wiring layer on which the pads are provided such that they correspond to the terminal electrodes, and an overcoat resin that covers the first conductive wiring layer excluding the pads. The terminal electrodes of the chip component are adhered to the pads by a conductive adhesive and an insulating adhesive is provided between the pads.

Hybrid integrated circuit device with high melting point brazing material

To make thin a circuit devicein which are incorporated a plurality of types of circuit elementsthat differ in thickness, first conductive patterns, onto which comparatively thin circuit elementsA are mounted, are formed thickly, and second conductive patternsB, onto which comparatively thick second circuit elementsB are mounted, are formed thinly. Also, fine wiring parts may be formed using the thinly formed second conductive patternsB. Thus even in the case where thick circuit elements are incorporated, by affixing such circuit elements onto the thinly formed second conductive patternsB, the total thickness can be made thin. Thinning of circuit deviceas a whole can thus be accomplished.

Circuit device with conductive patterns separated by insulating resin-filled grooves

A circuit devicecomprises conductive patterns, separated by separation grooves, circuit elements, affixed onto conductive patterns, and an insulating resin, covering circuit elementsand conductive patternsand filling separation grooveswhile exposing the rear surfaces of conductive patterns. Constricted partsare formed at side surfaces of separation grooves. At constricted parts, the width of separation groovesis made narrower than at other locations. Thus by making insulating resinadhere closely to constricted parts, the adhesion of insulating resinwith conductive patternsis improved.

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Gunma, Japan

Nobuhisa Takakusaki