Growing community of inventors

Shiga, Japan

Nobuhiro Yoshimura

Average Co-Inventor Count = 1.85

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 1

Nobuhiro YoshimuraRyo Umeki (3 patents)Nobuhiro YoshimuraKazuki Iwamura (2 patents)Nobuhiro YoshimuraYoshitaka Tanaka (1 patent)Nobuhiro YoshimuraShigeyuki Watanabe (1 patent)Nobuhiro YoshimuraTakafumi Masuda (1 patent)Nobuhiro YoshimuraDaiki Funaoka (4 patents)Nobuhiro YoshimuraShuji Kubota (1 patent)Nobuhiro YoshimuraYuhei Fukumoto (1 patent)Nobuhiro YoshimuraKiyofumi Sakai (1 patent)Nobuhiro YoshimuraOsamu Mabuchi (1 patent)Nobuhiro YoshimuraMotonori Takita (0 patent)Nobuhiro YoshimuraNobuhiro Yoshimura (8 patents)Ryo UmekiRyo Umeki (6 patents)Kazuki IwamuraKazuki Iwamura (2 patents)Yoshitaka TanakaYoshitaka Tanaka (10 patents)Shigeyuki WatanabeShigeyuki Watanabe (9 patents)Takafumi MasudaTakafumi Masuda (7 patents)Daiki FunaokaDaiki Funaoka (4 patents)Shuji KubotaShuji Kubota (2 patents)Yuhei FukumotoYuhei Fukumoto (1 patent)Kiyofumi SakaiKiyofumi Sakai (1 patent)Osamu MabuchiOsamu Mabuchi (1 patent)Motonori TakitaMotonori Takita (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Toyobo Co., Ltd. (5 from 394 patents)

2. Toyobo Mc Corporation (3 from 36 patents)


8 patents:

1. 12473464 - Thermal adhesive laminated oriented film

2. 12448515 - Method for producing polyamide resin composition

3. 11999850 - Glass-fiber-reinforced polyamide resin composition and molded product for vehicle interior or vehicle exterior made therefrom

4. 11993713 - Polyamide resin composition and method for producing same

5. 10934432 - Conductive polyamide resin composition

6. 10676616 - Polyamide resin composition

7. 10526485 - Polyamide resin composition having thermal aging resistance and method for enhancing thermal aging resistance of polyamide resin

8. 10011700 - Polyamide resin composition and method for enhancing thermal aging resistance of polyamide resin

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as of
12/12/2025
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