Ebara Corporation

Nobuhiro Yanaka

Masayuki Nakanishi

Kenji Kodera

A polishing apparatusincludes a holding stagethat holds a central portion of a back surface of a substrate W, a motor Mthat rotates the holding stage, a front surface nozzlethat feeds a rinse liquid to a front surface of the substrate W, a back surface nozzlethat feeds the rinse liquid to a back surface of the substrate W, a rinse liquid control sectionthat feeds the rinse liquid through the back surface nozzleafter a preset time elapses since the start of feeding of the rinse liquid through the front surface nozzleand a polishing head assemblyA that polishes a peripheral portion of the substrate installed on the holding stageafter the rinse liquid control sectionfeeds the rinse liquid to the substrate W.

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Tokyo, Japan

Nobuhiro Yanaka