Showa Denko K.k.

Kabushiki Kaisha Toyota Jidoshokki

Kabushiki Kaisha Toshiba Jidoshokki

Showa Denko Kabushiki Kaisha

Nobuhiro Wakabayashi

Keiji Toh

Shinobu Yamauchi

Shintaro Nakagawa

Katsufumi Tanaka

Eiji Kono

Yuichi Furukawa

Kota Otoshi

Hidehito Kubo

Shogo Mori

Masahiko Kimbara

Hideyasu Obara

Ryoichi Hoshino

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.

Base for power module

A heat sink () for power module is capable of mounting a power device () on at least a surface of the heat sink. The heat sink includes a refrigerant passage () in which cooling medium that dissipates heat generated by the power device () flows and a corrugated fin body () arranged in the refrigerant passage (). The corrugated fin body () has crests () and troughs () that extend in the flow direction of the cooling medium, and side walls () each of which connects the corresponding one of the crests () with the adjacent one of the troughs (). Each adjacent pair of the side walls () and the corresponding one of the crests () or the corresponding one of the troughs () arranged between the adjacent side walls () form a fin (). Each of the side walls () has a louver () that operates to, at least, rotate the cooling medium flowing in the associated fin (). The heat sink () thus has a further improved heat dissipating performance.

Heat sink for power module

A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sinkfor a power module has a laminating body, a first side plateand a second side plate. The laminating bodyhas plural flow path platesformed in a plate shape in which plural groovesparallel to each other are concavely arranged on a flat joining face. Each grooveis set to a parallel flow pathparallel to a front face side by laminating each flow path plateby each joining face. A portion other than each grooveof each joining faceforms a heat transfer pathto each parallel flow pathof a laminating direction. A flow-in pathand a flow-out pathare formed in the first and second side plates. The flow-in pathand the flow-out pathare joined to side facesof the laminating body, and are communicated with each parallel flow path. The flow-in pathflows a cooling medium into each parallel flow path. The flow-out pathflows the cooling medium out of each parallel flow path. A refrigerant flow path is constructed by the flow-in path, each parallel flow pathand the flow-out path

A heat radiatorincludes an insulating substratewhose first side serves as a heat-generating-element-mounting side, and a heat sinkfixed to a second side of the insulating substrate. A metal layeris formed on the second side of the insulating substrateopposite the heat-generating-element-mounting side. A stress relaxation memberformed of a high-thermal-conduction material intervenes between the metal layerof the insulating substrateand the heat sinkand includes a plate-like bodyand a plurality of projectionsformed at intervals on one side of the plate-like body. The end faces of the projectionsof the stress relaxation memberare brazed to the metal layer, whereas the side of the plate-like bodyon which the projectionsare not formed is brazed to the heat sink. This heat radiatoris low in material cost and exhibits excellent heat radiation performance.

Heat radiator and power module

A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.

A semiconductor moduleincludes a ceramic substrate having a front surface on which a semiconductor elementis mounted and a rear surface on the opposite side of the front surface, a front metal platejoined to the front surface, a rear metal platejoined to the rear surface, and a heat sinkjoined to the rear metal plate. The rear metal plateincludes a joint surfacethat faces the heat sink. The joint surfaceincludes a joint area and a non-joint area. The non-joint area includes recesseswhich extend in the thickness direction of the rear metal plate. The joint area of the rear metal plateis in a range from 65% to 85% of the total area of the joint surfaceon the rear metal plate. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Growing community of inventors

Oyama, Japan

Nobuhiro Wakabayashi