Taiyo Yuden Co., Ltd.

Taiyo Yuden Kabushiki Kaisha

Nobuhiro Umeyama

Hideo Aoba

Kazuhiko Otsuka

Takayuki Uehara

Nobuo Mamada

Nobuyasu Shiba

Katsuo Koizumi

Yoshihiro Amada

Iwao Fujikawa

Hideki Ogawa

Kenichiro Nogi

The present invention provides an electronic chip component (e.g., a chip inductor) small in size, and a manufacturing method thereof capable of shaping of the outer dimensions of the component into a desirable shape. The method involves press-fitting a chip inductor element into a component storage section of a mold plate comprised of a heat resistant rubber elastic member including the component storage section, while a resin coating material is coated on the element and dried to a dry-to-touch state, thereby hardening the resin coating material and automatically shaping the chip inductor element into a desired outer shape.

Electronic chip component and manufacturing method thereof

A wire wound electronic component of the present invention includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange A conductive film or external electrode is formed on each flange A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films A coating or armor is formed on the coil and has a flat surface The coating has a rectangular configuration complementary to the configuration of the flanges

Method of manufacturing wire wound electronic component

A wire wound electronic component includes a bobbin having a core having a substantially circular cross-section and rectangular flanges formed at both ends of the core. A groove is formed in each side of each flange . A conductive film or external electrode is formed on each flange . A coil or wire is wound round the core and has a conductor protruding from opposite stripped ends thereof. The opposite ends of the conductor are respectively received in the grooves of the flanges and connected to the conductive films . A coating or armor is formed on the coil and has a flat surface . The coating has a rectangular configuration complementary to the configuration of the flanges

A wire wound electronic component of the present invention includes a bobbin having a core 1a having a substantially circular cross-section and rectangular flanges 1b formed at both ends of the core. A groove 2 is formed in each side of each flange 1b. A conductive film or external electrode 3 is formed on each flange 1b. A coil or wire 4 is wound round the core 1a and has a conductor protruding from opposite stripped ends thereof. The opposite ends 5 of the conductor are respectively received in the grooves 2 of the flanges 1b and connected to the conductive films 3. A coating or armor 6 is formed on the coil 4 and has a flat surface 6a. The coating 6 has a rectangular figuration complementary to the configuration of the flanges 1b.

Wire wound electronic component and method of manufacturing the same

A winding core is formed by extruding a kneaded material which is obtained by kneading a powdered magnetic material and a binder. A conducting wire is wound around the winding core in a coiled manner. An external cover element is formed by extruding the kneaded material to enclose the winding core, and the winding core and the external cover element are sintered. The semimanufactured product obtained by the above steps is cut into a predetermined length to thereby obtain a plurality of chip inductor main bodies. An external electrode is formed on each of end surfaces of the respective chip inductor main bodies such that the external electrode is connected to each of end portions of the conducting wire, the end portions being exposed to both end surfaces of the respective chip inductor main bodies.

Growing community of inventors

Fujioka, Japan

Nobuhiro Umeyama