Konica-minolta Holdings, Inc.

Nobuhiro Ueno

Yasuo Nishi

Masakazu Date

Isao Doi

Nobuhisa Ishida

Atsuro Yanata

Provided is an anode bonding method by which a silicon substrate and a glass substrate are well anodically bonded without generating positional shift, even when an electrode cannot be arranged on a surface on the opposite side to a bonding surface of a glass substrate and the bonding surface is large. The method for anodically bonding the glass substrate and the silicon substrate is provided with a step of placing on the glass substrate the silicon substrate whereupon a through hole is arranged; a step of bringing the anode electrode into contact with the surface of the overlapped silicon substrate opposite to the surface facing the glass substrate, and bringing an cathode electrode into contact with the glass substrate through the through hole arranged on the silicon substrate; and a step of applying a direct current voltage to the anode electrode and the cathode electrode in a state where the glass substrate and the silicon substrate are heated.

Anode bonding method and producing method of liquid droplet discharging head

In a liquid ejecting apparatus using the electrostatic attraction method or electric field assist method, a liquid ejecting apparatus where discharging of a nozzle plate is securely performed and appropriate liquid ejecting is possible is provide. The liquid ejecting apparatus is provided with an electrode; a liquid ejecting head, having, a nozzle plate including a nozzle opposed to the counter electrode to eject liquid, a pressure generating device to rise a meniscus of liquid at a ejecting port of the nozzle, and a charging electrode opposed to the counter electrode via the nozzle plate, an electrostatic voltage applying device to apply electrostatic voltage onto the liquid in the nozzle; a discharging device to discharge the charged nozzle plate; and a control device to control the electrostatic voltage applying device and the discharging device; wherein the discharging device provides a conductive discharging member detachable to an whole area of the nozzle plate opposed to the counter electrode.

Liquid ejecting apparatus

In a liquid ejection apparatus, having: a liquid ejection head having, a nozzle plate having a nozzle to eject liquid, a cavity to reserve liquid ejected form a ejection hole of the nozzle, a pressure generating device to form a meniscus of the liquid, and a ejecting voltage applying device to apply a ejection voltage to the liquid in the nozzle; a operation control device to control application a drive voltage to drive the pressure generating device and application of the ejection voltage by the ejection voltage applying device; and a counter electrode opposite to the liquid ejection head; wherein in the liquid ejection device in which the liquid is ejected by a static electric attraction force generated between the liquid in the nozzle to which a voltage is applied by the ejection voltage applying device and the counter electrode, and by a pressure generated in the nozzle, the pressure generating device to form the liquid meniscus forms the meniscus having a height of equal to or more than 1.3 times a radius of the nozzle on the ejection hole of the nozzle.

Liquid ejection apparatus

A liquid ejection head having: a nozzle for ejecting a liquid; a flat nozzle plate on which the nozzle is provided; a cavity to store the liquid to be ejected from an ejection hole of the nozzle; a pressure generating section which generates pressure on the liquid in the nozzle and forms a meniscus of the liquid in the ejection hole of the nozzle; an electrostatic voltage applying section which applies electrostatic voltage between a base material and the liquid in the nozzle and the cavity, and generates electrostatic suction force; and an operation control section which controls applying of the electrostatic voltage by the electrostatic voltage applying section, and controls applying of drive voltage to drive the pressure generating portion, wherein a volume resistivity of the nozzle plate is 10&#x3a9;m or more.

Liquid ejection head, liquid ejection device and liquid ejection method

Liquid ejecting apparatusfor ejecting electrically charged droplets of the liquid solution onto base member K, which includes liquid ejecting headto eject the droplets from top endof nozzle, with the inner diameter equal to or less than 100 &#x3bc;m, liquid solution supplying sectionto supply the liquid solution into nozzle, and ejection voltage applying sectionto apply the ejection voltage onto the liquid solution in nozzle. In liquid ejecting apparatus, nozzleprojects toward the droplet ejecting direction from nozzle planeon nozzle platefacing base member K, whereby the projecting length of nozzleis equal to or less than 30 &#x3bc;m.

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Takatsuki, Japan

Nobuhiro Ueno