Hitachi, Ltd.

Hitachi Tokyo Electronics

Hitachi Tokyo Engineering Co., Ltd.

Nobuhiro Takasugi

Ryuichi Kyomasu

Kenji Watanabe

Osamu Kakutani

Tsutomu Mimata

Isamu Yamazaki

The invention relates to a manufacturing apparatus which comprises moving means which continuously moves the works that are transferred along a frame chute, and detector means which detects at least a portion of the work that is moved. The moving means is controlled by kind-of-work data and by a work position signal from the detector means, and the work is set to a predetermined position. Hence, even a work of a different kind can be set to an optimum bonding position without the need of exchanging the unit, making it possible to perform the operation fully automatically and to meet general purposes. Further, provision is made of means which moves the frame chute in a direction at right angles with the direction in which the work is moved, so that even that work that has different widths and shapes in the widthwise direction can be placed in position and subjected to the bonding fully automatically. The detector means can be provided not only at the bonding position but also at a position on the upstream side having a relation relative to the bonding position. The invention can be adapted particularly effectively to a wire bonder and a pellet bonder.

Manufacturing method

Manufacturing apparatus

In a wire bonding apparatus in which, by identifying recognition marks of a pellet or leads displaced from a reference position in wire-bonding a pellet of a semiconductor device to leads within a field of view of a television camera, the displacements of the bonding positions of the pellet and the lead are corrected and then bonding pads on the pellet are connected to the leads by wires, the field of view is moved from a reference view position in a given moving manner, whereby the recognition marks may be identified rapidly and reliably. This apparatus is well adapted for the wire bonding of a semiconductor device of the DILG sealing type, for example, which is poor in the position accuracy of the bonding position.

Wire bonding apparatus

Growing community of inventors

Tokyo, Japan

Nobuhiro Takasugi