Sipec Corporation

Other

Hashimoto Chemical Industries Co., Ltd.

Kabushiki Kaisha Ultraclean Technology Research Institute

Kurita Water Industries Ltd.

Caterpillar Sarl

Hitachi Plant Engineering Construction Co., Ltd.

Hashimoto Chemical Co., Ltd.

Fujiken, Inc.

Hashimoto Kasei Kabushiki-kaisya

Nobuhiro Miki

Takahisa Nitta

Tadahiro Ohmi

Matagoro Maeno

Hirohisa Kikuyama

Hiroyuki Harada

Yoshiaki Yamaguchi

Toshiro Fukutome

Yoshihiro Eto

Norio Terasawa

Masahiro Sakata

Nobukazu Ikeda

Yutaka Yokoyama

Tetsuya Yoshino

Yoshiyuki Shimada

Naofumi Yasumoto

Yuya Kanenawa

Yasuyuki Harada

Yutaka Mikasa

Kazuo Chiba

Toshiro Fukudome

Takesi Kaibori

Matagoroh Maeno

Takayasu Kitai

Ryozi Hirayama

Kenji Ishigaki

The present invention is intended to provide a technology that can utilize the advantages of both a load sensing control and a regeneration circuit without causing any problem. A regeneration circuit is added to a hydraulic circuit provided with a hydraulic pressure signal line for detecting a hydraulic pressure value of a circuit and controlling a volume of hydraulic fluid to a cylinderwith reference to the detected value. A pressure reducing valvethat outputs a reduced pressure as an operating signal to a pump, and subsequently the controlling meanscauses the pressure reducing valveto output a pressure reduction command to a pumpand thus to reduce a discharge rate from the pump, when the regeneration circuit is in a regeneration state.

Method for controlling pump of working machine

A chemical supply system comprises, as principal elements, a chemical storage tank in which a liquid chemical for cleaning is stored in the state of its formulated concentrate, a chemical supply apparatus connected to the chemical storage tank for positively performing chemical supply, a piping system connected to the chemical supply apparatus to form a supply flow passage that is a passage for ultrapure water which the liquid chemical is to be mixed with, a pair of discharge nozzles disposed at end portions of the piping system so as to oppose surfaces of a wafer set in a cleaning chamber to supply a cleaning liquid onto the surfaces. Thereby, remarkable miniaturization/simplification of a cleaning liquid supply system including chemical tanks is intended, it is made possible easily and rapidly to compound and supply a cleaning liquid at an accurate chemical concentration, and particles or the like being generated and mixing in a cleaning liquid, are suppressed to the extremity.

Chemical supply system

By a simple apparatus construction and process, it is made possible to &ldquo;clean precisely&rdquo; a surface at the molecular/atomic level, and the purification degree of the surface processed minutely is made into 10 molecules/cm or less. A steam-spraying nozzle is disposed such that a line slit nozzle is in a diameter direction, and mist-containing steam is sprayed onto the surface of a substrate. Thereby, particles in the steam-spraying surface (the particles were made to adhere by dipping the substrate in a solution containing polystyrene (particle diameter of 0.6 &mgr;m) or alumina (particle diameter of 0.3 &mgr;m to 0.5 &mgr;m) particles at 10 particles/ml.) are removed by about 90% to 95% after ten-seconds spraying, and by 99% or more, that is, to less than the detection limit of a wafer inspection device, after twenty-seconds spraying.

Surface purification apparatus and surface purification method

A line slit nozzle for spraying steam is disposed along a diameter of a resist film. Steam containing a mist is sprayed onto a surface of the resist film. The film is thereby peeled off and removed. By using a change in physical properties (swelling, etc.) of the resist film by water, the film is easily and surely peeled off. Breakaway from much resources/energy consumption type techniques is realized. In other words, realized are environment-symbiosis type techniques by which resist films can be removed independently of the quantity of energy and kinds of chemical solvents.

Resist film removal apparatus and resist film removal method

An ultraviolet light reaction system is constructed for surface cleaning/surface processing, a processing speed and an apparatus size that can not be attained by any conventional chemical reaction system, are realized, and realization of a time-sharing performance/a high-throughput performance/a compact size is intended. Using an excimer ultraviolet lamp whose light source is excimer ultraviolet rays of a wavelength that transmissive distances to air, gas, and water are 2 mm or more, respectively, surface processing (such as a surface cleaning process) of a substrate disposed in a one-by-one substrate chamber is preformed.

Ultraviolet processing apparatus and ultraviolet processing method

Washing apparatus and washing method

An industrial material such as metal, ceramics or plastics whose surface has a film passivated by fluoridation and a process of manufacturing the above industrial material. The industrial material comprises a substrate, a nickel alloy film formed on the substrate and containing nickel, semimetal and/or other metal whose fluoride becomes a volatile compound, and a fluorine passivated film formed at least on a surface of the nickel alloy film in such a manner that the fluorine passivated film contains nickel and does not contain said other metal or the semimetal, and satisfies stoichiometric ratio. The process of manufacturing an industrial material comprises the steps of performing grounding treatment of a surface of a substrate, forming a nickel alloy film, on the surface of the substrate, containing nickel, semimetal and/or other metal, and forming a fluorine passivated film on the nickel alloy film.

Industrial material with fluorine passivated film and process of manufacturing the same

An apparatus for injecting constant quantitative chemicals which is capable of injecting a chemical solution into ultra pure water without generating particulate contamination, and furthermore, the injection interval of the chemical solution to the cleaning nozzle is controlled in units of seconds within a range of a few seconds to 10 or more seconds, and the switching of the type of chemical solution and the changeover to ultra pure water cleaning can be conducted in a short period of time of approximately 1 second. The apparatus includes a chemical solution injection system having a chemical solution retaining part for retaining the chemical solution, a control system for pressurization and depressurization for controlling the pressure of the chemical solution in the chemical solution retaining part at regular intervals, an injection control system which operates in concert with the control of the pressure of the chemical solution, and is structured so as to conduct the intermittent injection and instantaneous mixing function of the chemical solution from the chemical solution injection system to the ultra pure water flow path, and the injection stoppage function, and a chemical solution replenishment system which is structured so as to operate in concert with the control of the chemical solution and to be capable of replenishing the chemical solution in the chemical solution retaining part from a chemical solution source.

Apparatus for injecting constant quantitative chemicals and a method

Fluorine is recovered as calcium fluoride from a fluoroetchant solution composed mainly of hydrogen fluoride and ammonium fluoride using a sealed reaction tank equipped with a supply port for adding the fluoroetchant solution to the tank, a supply port for adding calcium carbonate to the tank, a vapor supply port for adding steam to heat the solution in the tank, an air supply port for providing air to aerate the contents of the tank, a stirrer for stirring the contents of the tank, an ejector for removing vapors from the tank connected to the tank via a mist separator for separating mist from the vapors being removed from the tank, and an exhaust port for removing calcium fluoride from the tank.

Apparatus for recovering calcium fluoride from fluoroetchant

Calcium fluoride with high purity of very small content of unreacted calcium carbonate and silica is recovered from an etchant mainly composed of hydrogen fluoride or hydrogen fluoride and ammonium fluoride. The etchant is reacted with calcium carbonate with transfer directions of the etchant and calcium carbonate being controlled within a composition region in which mole equivalent ratio of ammonium fluoride/hydrogen fluoride is specified.

Method for recovering calcium fluoride from fluoroetchant

A method of preparing hydrofluoric acid of high purity at the point of use by causing molecular diffusion of hydrogen fluoride into ultrapure water through a resin membrane. The high-purity acid is available at the site of use free of contamination that would occur during transport from a site of preparation.

Method of supplying dilute hydrofluoric acid and apparatus for use in

Tungsten film forming apparatus

A brazing flux for aluminum material having superior suspension stability whose melting composition of the flux is composed of four elements of MxAlFyOz (where: x=0.5 to 2.0, y=1.5 to 4.8 and z=0.1 to 1.0), and a method of producing a brazing flux in which an amorphous aluminum hydroxide is employed as an aluminum raw material to prepare the flux.

Brazing flux of stable suspension for aluminum material

Growing community of inventors

Tokyo, Japan

Nobuhiro Miki