Nec Corporation

Lenovo Innovations Limited (hong Kong)

Mitsubishi Electric Corporation

Lenovo Innovations Limited

Nobuhiro Mikami

Shinji Watanabe

Junya Sato

Atsumasa Sawada

Nozomu Nishimura

Katsumi Abe

Yoshiaki Kobayashi

Yasuhiro Sasaki

Shigeki Shinoda

Takaaki Yoshihiro

Soichiro Takata

Kenichiro Fujii

Shin Tominaga

Masatake Takahashi

Shigeru Kasai

Toru Taura

Shohei Kinoshita

Yasuhiro Sogawa

In order to supplement results of diagnosis of degradation of an object that has been implemented at set intervals using a degradation progression model for simulating the progression of degradation of the object, a degradation prediction apparatusis provided with: a data generation unitconfigured to generate, as supplement data, diagnosis results that would be obtained if the degradation diagnosis were performed at an interval shorter than the set interval; a prediction model generation unitconfigured, using the supplement data, to generate a prediction model for predicting a degradation index indicating a degradation state of the object at a specific point in time; and a degradation index prediction unitconfigured to predict the degradation index of the object based on the prediction model.

Degradation prediction apparatus, degradation prediction method, and computer-readable recording medium

An air conditioner includes an outdoor unit, a relay circuit which includes a contact and a relay coil, and a control unit which causes a first voltage equal to or higher than an operating voltage or a second voltage lower than the operating voltage and equal to or higher than a retention voltage to be applied to the relay coil. One end portion of the contact is connected to an alternating-current power supply and the other end portion of the contact is connected to the outdoor unit. One end portion of the relay coil is connected to a power supply for driving the relay circuit. The control unit causes a second voltage to be applied to the relay coil after the contact is turned ON, and causes the first voltage to be applied to the relay coil at a predetermined constant period.

Air conditioner having relay coil abnormality voltage control

In a related fluid leakage detecting device, erroneous leakage determination may occur due to a change in a state of a fluid in piping. A leakage determination system of the present invention includes a first detection means for detecting a prescribed physical quantity indicating a state of a fluid in piping, a second detection means for detecting vibration propagating through the piping, and a leakage determination means for performing leakage determination based on the physical quantity detected by the first detection means and the vibration detected by the second detection means.

Leakage determination system and leakage determination method

A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Component built-in module, electronic device including same, and method for manufacturing component built-in module

A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board, a semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portion. The pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

Mount board and electronic device

A failure prediction system for performing failure prediction to a monitoring target device by detecting a state, comprising: a state detection unit for detecting state signals of no smaller than two different kinds, and outputting a detection signal corresponding to each of the state signals; a phase processing part for synchronizing a plurality of the detection signals; a signal analysis part for calculating a feature value indicating a feature of the state for each of the detection signals from the phase processing part; and a failure prediction part for performing failure prediction of the monitoring target device for each of the feature values by comparing the feature value in question and a reference value set in advance.

Failure prediction method and failure prediction system

An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount boarda semiconductor packageis mounted on a curved boardincluding a curved surface on at least a portion thereof. The curved boardincludes a pedestal portiondisposed on a region of the curved surface portion where the semiconductor packageis mounted and having an upper surface thereof formed flat, and a plurality of pad portionsdisposed on the flat surface of the pedestal portionThe pedestal portionis formed of an insulating material. The semiconductor packageis mounted on the pad portions

A switch integrated type housing includes a housing body, a switch button sheet, a conductor and a cover sheet. The housing body is provided with a plurality of concave sections on an outer surface of the housing body. The switch button sheet is provided on the outer surface to cover the plurality of concave sections. The conductor has a dome shape downwardly projecting and is provided in each of the plurality of concave sections to contact the switch button sheet. The cover sheet is provided between the switch button sheet and the outer surface of the housing body in a portion of the outer surface of the housing body other than the plurality of concave sections and to cover a lower surface of the conductor in each of the plurality of concave sections.

Switch integrated casing and electronic equipment having the casing

A heat dissipating structure and a portable device are provided, which enable that heat is dissipated from a heat generating part without causing a user to feel discomfort. A heat transfer member is configured to transfer heat generated in a heat generating body and a thermal storrage unit is thermally connected to the heat transfer member. The thermal storrage unit includes a pack with stretching property and a thermal storrage medium which is filled in the pack and a volume of which changes with a change in temperature. The pack is arranged such that there is a gap between the pack and a first heat dissipating portion at normal temperature and the pack contacts the first heat dissipating portion when the thermal storrage medium expands with a change in temperature.

Heat dissipating structure and portable phone

A circuit board device includes: plurality of wiring boards (and) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member () arranged between wiring boards (and) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block () composed of a metal material and arranged between the wiring boards (and) to enclose anisotropic conductive member (), and a pair of holding blocks (and) composed of a metal material arranged to clamp the plurality of wiring boards (and), wherein the plurality of wiring boards (and), while in a state of being clamped between the pair of holding blocks (and), is connected together by the anisotropic conductive member () and the terminals provided on each of the wiring boards (and), the functional block (), and the holding blocks (and) are electrically connected.

Circuit board device, wiring board interconnection method, and circuit board module device

A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards-, anisotropically conductive membersplaced between the individual wiring boards, functional blocksseparate from anisotropically conductive membersand are placed on the same plane as anisotropically conductive membersso as to enclose anisotropically conductive members, and a pair of holding blocksplaced to sandwich wiring boards-. These wiring boards-are kept compressed while they are clamped between pair of holding blocks, so that they are electrically connected with each other by anisotropically conductive members

Circuit board device, wiring board connecting method, and circuit board module device

An object of the present invention is to prevent occurrence of an electrical fault such as signal disconnection due to exfoliation between a via and a printed circuit board, via crack, or the like, caused by various stresses that may arise when the printed circuit board is curved. The printed circuit board includes a first wiring layer, an electrical insulating base materialformed on the first wiring layerand including a via base holethat leads to the first wiring layer, and a second wiring layerthat is formed on the electrical insulating base materialand is electrically connected to the first wiring layerthrough the via base hole. In a region of the second wiring layerdisposed at least in the vicinity of the via base hole, a stress relieving portionis formed which relieves bending stress, tensile stress, compressive stress, and shear stress that may arise when the electrical insulating base materialis curved.

Printed circuit board and semiconductor package

Even when a substrate on which a semiconductor package has been mounted is made curved, stress upon electrical connections is mitigated, thereby eliminating faulty connections and improving connection reliability. A semiconductor chip has electrodes on a second face thereof. Support blocks, capable of bending and flexing, are placed at two locations on a peripheral edge of a first face of the semiconductor chip. An interposer is placed so as to span the support blocks with the support blocks interposed between itself and the semiconductor chip, and has a wiring pattern in a flexible resin film. Two end portions of the interposer are folded back onto the side of the second face of the semiconductor chip, and the wiring pattern thereof is electrically connected to the electrodes of the semiconductor chip.

Growing community of inventors

Tokyo, Japan

Nobuhiro Mikami