Taiyo Holdings Co., Ltd.

Nobuhiro Ishikawa

Shoko Mishima

Kota Oki

Satoko Matsumura

Mami Nosaka

Toshiaki Masuda

Shoya Sekiguchi

Provided is a curable resin laminate capable of easily producing an insulating layer having low dielectric properties and excellent adhesion (peel strength) to a conductor layer. A curable resin laminate includes: a first resin layer including a first curable composition, and a second resin layer including a second curable composition and laminated on the first resin layer. The second resin layer has a thickness of 5 to 35% relative to a total thickness of the first resin layer and the second resin layer, the first curable composition contains (A1) a polyphenylene ether and a filler, and a content rate (M) of the filler is 30% by mass or more relative to a total solid content. The second curable composition contains (A2) a polyphenylene ether, and a content rate (M) of a filler is 40% by mass or less relative to a solid content, M>M, and (A1) and (A2) have a slope that is less than 0.6, calculated by a conformation plot.

Curable resin multilayer body, dry film, cured product and electronic component

The present invention provides a poly(phenylene ether) which retains low-dielectric characteristics and is soluble in various solvents. The poly(phenylene ether) is characterized by being obtained from one or more raw-material phenols including a phenol satisfying at least Requirement 1 (to have hydrogen atoms in the ortho and para positions) and by having a slope calculated from a conformational plot of less than 0.6.

Poly(phenylene ether), curable composition containing poly(phenylene ether), dry film, prepreg, cured object, laminate, and electronic component

Growing community of inventors

Hiki-gun, Japan

Nobuhiro Ishikawa