Shin-etsu Chemical Co., Ltd.

Nobuhiro Ichiroku

Toshio Shiobara

Hideo Nakagawa

Hideki Akiba

Shouhei Kozakai

Masachika Yoshino

Koji Futatsumori

Takayuki Kusunoki

Miyuki Wakao

Akio Suzuki

Kazuhiro Arai

Tsuyoshi Honda

Masao Ando

Atsushi Wakamiya

Yuko Matsushige

A heat-conductive silicone grease composition comprising (A) an organopolysiloxane in an amount of 20 to 90 parts by mass, (B) a non-silicone-type organic compound in an amount of 80 to 10 parts by mass (wherein the total amount of the components (A) and (B) is 100 parts by mass) and (C) a heat-conductive inorganic filler having an average particle diameter of 0.5 to 100 &#x3bc;m in an amount of 200 to 2,000 parts by mass relative to 100 parts by mass of the total amount of the components (A) and (B), wherein the SP value of the non-silicone-type organic compound (B) is greater than that of the organopolysiloxane (A) (i.e., (B)&#x3e;(A)), the value obtained by subtracting the SP value of the component (A) from the SP value of the component (B) is greater than 2, and the viscosity of the heat-conductive silicone grease composition is 50 to 1,000 Pa&#xb7;s at 25&#xb0; C.

Heat-conductive silicone grease composition

There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2)Si(OR)&#x2003;&#x2003;(1)RSi(OR)&#x2003;&#x2003;(2),wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80&#xb0; C. to 180&#xb0; C. and a surface tension of 20 to 30 dyne/cm at 25&#xb0; C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.

Adhesive composition and sheet for forming semiconductor wafer-protective film

Provided is an adhesive composition, which exhibits a melt viscosity at 40 to 80&#xb0; C. of not more than 10,000 Pa&#xb7;s, and which after heating for a period of 1 minute to 2 hours at a temperature within a range from 80&#xb0; C. to (T+50)&#xb0; C., exhibits a melt viscosity at a temperature of 100&#xb0; C. to (T+30)&#xb0; C. that is within a range from 100 to 10,000 Pa&#xb7;s (wherein, T represents the curing start temperature for the composition). The adhesive composition is capable of forming a cured product that exhibits excellent filling of substrates with finely patterned circuits, excellent lamination performance at low temperatures, a low elastic modulus, and excellent levels of adhesion and heat resistance. The adhesive composition is useful for providing an adhesive film and for producing a semiconductor device.

Adhesive exhibiting maximum melt viscosity of 10,000 Pa s at 40 to 80 degrees C

An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein Rmay be the same with or different from each other and is a substituted or unsubstituted Calkyl group, and Ris a substituted or unsubstituted Cmonovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).

Adhesive composition and adhesive film therefrom

A partial block polyimide-polysiloxane copolymer is provided comprising repeat unit structures having structural formulae (1) and (2) wherein X is an aromatic or aliphatic ring-containing tetravalent organic radical, Yis a diamine residue, Yis a diaminosiloxane residue, Yand Yare contained in the copolymer in amounts of 99-20 mol % and 1-80 mol %, respectively, L and m each are an integer of 2-50. The copolymer has good adhesion to substrates, moisture-proof reliability and a low modulus of elasticity. 

Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer

Adhesive composition and sheet having an adhesive layer of the composition

An adhesive composition is provided comprising (A) a polyimide resin containing a diorganopolysiloxane linkage having vinyl groups as organic substituent groups on the backbone, (B) an epoxy resin, and (C) an epoxy resin-curing catalyst. An adhesive film prepared from the adhesive composition has a high bond strength to various substrates and to encapsulating resins when thermocompression bonded and heat cured thereto, and possesses a low modulus of elasticity and high heat resistance, ensuring manufacture of resin packaged semiconductor devices with high reliability.

Adhesive composition and adhesive film

A dicing/die bonding adhesion tape includes a substrate, a silicone adhesive layer, and a bonding layer. A tack strength of 0.2&#x2013;2.0 N/25 mm is developed between the silicone adhesive layer and the bonding layer. The bonding layer is formed of a bonding composition comprising (A) a polyimide resin, (B) an epoxy resin, and (C) an epoxy resin curing catalyst.

Dicing/die bonding adhesion tape

In a wafer dicing/die bonding sheet comprising a backing member, an adhesive layer, and a protective member, the adhesive layer is made of an adhesive composition comprising a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent, the ratio of the total weight of the epoxy resin and the epoxy resin curing agent to the weight of the polyimide resin being from 0.1:1 to 3:1. Due to heat resistance, improved adhesive properties and a low modulus of elasticity, the wafer dicing/die bonding sheet is effective for reducing the warpage of a chip after die bonding.

Wafer dicing/die bonding sheet

A resin composition comprising the associated product of a polyimide resin having phenolic hydroxyl groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin having at least two glycidyl groups, and an epoxy resin-curing agent has a high bond strength, a low modulus of elasticity and heat resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Heat resistant resin composition and adhesive film

A conductive resin composition primarily comprising (A) 100 parts by weight of a thermosetting or thermoplastic resin, (B) 5&#x2013;2,000 parts by weight of a conductive filler, and (C) 0.1&#x2013;300 parts by weight of organic resin or rubber particulates has a low volume resistivity and stability thereof, and is effectively adherent. When applied to semiconductor packages, the composition can prevent the semiconductor chips from warpage or cracking due to thermal stresses in the semiconductor packages, ensuring the fabrication of semiconductor devices with high reliability.

Conductive resin composition

A polyimide resin having phenolic hydroxyl radicals in its skeleton is prepared using a diamine bearing an aromatic ring having an amino radical attached thereto and another aromatic ring having a phenolic hydroxyl radical. The polyimide resin and a composition comprising the polyimide resin, an epoxy resin and a curing agent are suited for use as varnish, adhesive and adhesive film for which adhesion and heat resistance are required.

Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition

A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

A film-type adhesive for electronic components comprises a polyimide resin made up of specific repeating units and having a weight-average molecular weight of 5,000-150,000 in combination with an epoxy resin bearing at least two glycidyl groups per molecule. The adhesive has a weight ratio of the polyimide resin to the epoxy resin within a range of 50/50 to 5/95, and a film thickness of 20-150 &mgr;m. Such a film-type adhesive makes it possible to simplify and shorten the duration of assembly operations for electronic components having various types of adherend surfaces.

Film-type adhesive for electronic components, and electronic components bonded therewith

An epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, and (C) a silicone stress-reducing agent further includes (D) a foam-suppressing composition comprising (D-i) an oil compound consisting of a hydrophobic organopolysiloxane and finely divided silica, (D-ii) a hydrophilic polyoxyalkylene-modified silicone oil, and optionally, (D-iii) a polyoxyalkylene polymer. The epoxy resin composition has the advantages of improved infiltration to semiconductor device-substrate gaps and minimized formation of internal and surface voids.

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Gunma-ken, Japan

Nobuhiro Ichiroku