Sumitomo Bakelite Company Limited

Nobuhiro Higashida

Takashi Enoki

Yuichi Ishida

Hidenori Saito

Masako Okanuma

Mitsuru Murata

Takashi Yamaji

Mitsumoto Murayama

Tatsuhiro Yoshida

Takuya Hatao

Yoko Hase

Masanori Fujimoto

Tadahiro Ishikawa

Toshimasa Egucih

Yoko Mizumoto

A material for an insulating film which comprises a copolymer obtained by reacting a polyamide having a specific structure and a reactive oligomer as a component forming the film; a coating varnish for an insulating film which comprises this material and an organic solvent; an insulating film which comprises a layer of a resin comprising as a main structure a polybenzoxazole which is obtained by treating the above material or the above coating varnish by heating so that condensation reaction and crosslinking reaction take place and has fine pores; and a semiconductor device which comprises an insulating interlayer film for multi-layer wiring comprising the insulating film and/or a surface protective film comprising the insulating film. Excellent electrical, thermal and mechanical properties are exhibited and a low permittivity can be achieved.

Material for an insulating film, coating varnish for an insulating film, and insulating film and semiconductor device using the same

A novel aromatic carboxylic acid useful as a material for macromolecular compounds and, in particular, for polycondensed macromolecular compounds exhibiting excellent heat resistance, an acid halide derivative thereof and a process for producing these compounds are disclosed. The aromatic carboxylic acid and the acid halide derivative thereof have structures represented general formulae (1) and (2), respectively, and can be efficiently produced from a dialkyl ester derivative of isophthalic acid and an acetylene derivative in accordance with the disclosed process comprising specific steps.In the above formulae, A represents:&#x2014;C&#x2261;C&#x2014;R&#x2003;&#x2003;(a)or(Rrepresents hydrogen atom, an alkyl group or an aromatic group, Rrepresents an alkyl group or an aromatic group) and X represents a halogen atom.

Aromatic carboxylic acids, acid halides thereof and processes for preparing both

Precursor of a heat resistant resin, heat resistant resin, insulating film and semiconductor device

The present invention provides an insulating material showing excellent thermal propeties and electrical properties in semiconductor applications. That is, the present invention provides: a resin composition for insulating material, comprising, as essential components: (A) a compound having an amphiphatic property, and (B) a heat-resistant resin having a glass transition temperature higher than thermal decomposition temperature of the compound (A), or a precursor thereof; and an insulating material produced by a process which comprises steps of; allowing, in the above resin composition for insulating material, the compound (A) and the heat-resistance resin or the precursor thereof (B) to form a structure of separated phases, and then heat-treating the resulting resin composition at a temperature higher than thermal decomposition temperature of the compound (A) but lower than glass transition temperature of the heat-resistant resin (B) or the heat-resistant resin obtained by ring closure of the precursor thereof.

Resin composition for insulating material, and insulating material produced from said resin composition

A polybenzoxazole precursor having recurring units represented by the following general formula (1) and a polybenzoxazole resin having a structure obtained by cyclizing the polybenzoxazole precursor:

Polybenzoxazole resin and precursor thereof

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Izumiotsu, Japan

Nobuhiro Higashida