Sony Corporation

Nobuhiro Hanai

Noriyuki Honda

Masakazu Nakada

Sotaro Tsukamoto

Masato Hayashida

Satoru Kuromiya

The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection materialfor electrically connecting an electrical connection portion of a first objectand an electrical connection portion of a second objectThe electrical connection materialcomprises a first film-like adhesive layerwhich is a film-like adhesive layer arranged on the first objectand is composed of a plurality of conductive particlesa first bindercontaining the conductive particlesand a first filler Fand a second film-like adhesive layerwhich is arranged on the first film-like adhesive layerand is composed of a second binderA whose viscosity is lower than that of the first binderand a second filler F

Electrical connection materials and electrical connection method

A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

Wiring board and circuit module

The present invention is to provide an electrical connection material through which an electrical connection via conductive particles can be performed reliably regardless of a little unevenness of an object. The electrical connection material is an electrical connection materialfor electrically connecting an electrical connection portion of a first objectand an electrical connection portion of a second object. The electrical connection materialcomprises a first film-like adhesive layerwhich is a film-like adhesive layer arranged on the first objectand is composed of a plurality of conductive particles, a first bindercontaining the conductive particles, and a first filler Fand a second film-like adhesive layerwhich is arranged on the first film-like adhesive layerand is composed of a second binderA whose viscosity is lower than that of the first binderand a second filler F

Growing community of inventors

Aichi, Japan

Nobuhiro Hanai