Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Nobuhiko Muraoka

Syozo Kadota

Akira Kabeshita

Shinji Kanayama

Shinjiro Tsuji

Shuichi Hirata

Nobuhisa Watanabe

Kenichi Nishino

Masaru Ichihara

Shinzo Eguchi

Kazuaki Kosaka

Satoshi Ohnakada

Ikuko Obata

Hirohisa Mozaki

An adhesive tape affixing equipment for pulling out a tape from a supply reel on which the tape constructed by laminating an adhesive tape on a separator tape is wound, and then affixing the adhesive tape onto predetermined locations of a substrate by pushing the tape using a press-fitting tool. A radial direction of the supply reel is arranged to intersect substantially orthogonally with a longitudinal direction of the press-fitting tool during the affixing of the adhesive tape by the press-fitting tool. Also included is a tape running route setting device for causing the tape pulled out from the supply reel to run through an area between the press-fitting tool and the substrate along the longitudinal direction of the press-fitting tool via a tape running direction changing portion being provided to at least one location.

Adhesive tape affixing equipment and press-fitting equipment

A component mounting apparatus includes: a conveyor device for sucking and holding a substrate in a substantially vertical posture and conveying the substrate in a direction extending along its flat plate surface; a plurality of working devices for performing a working process for mounting areas in edge portions of the substantially vertical-postured substrate received from the conveyor device. In the component mounting apparatus, each of the working devices includes: a substrate holder for sucking and holding the substrate in a substantially vertical posture; a holder up/down device for moving the sucked and held substrate to a downward working position; a receiving member for supporting an edge portion of the substrate positioned in the working position from its back face side; and a working unit for performing the working process on the mounting areas of the edge portions of the substrate positioned in the working position from its front face side.

Component mounting apparatus and method

A component mounting apparatus for mounting components on a plurality of mounting regions placed on an edge part of a substrate along a first direction that is a direction along the edge part of the substrate, comprises component placing units for holding components placed in component delivery positions that are spaced from the edge part of the substrate in a second direction orthogonal to the first direction, moving the held components in the second direction, and placing the components onto the mounting regions, component feeding units for sequentially feeding the components to component feeding positions spaced from the component delivery positions, and component carrying units for holding the components fed to the component feeding positions, moving the held components, and placing the components in the component delivery positions. Therefore, the components can be placed even onto a large substrate with satisfactory working efficiency.

When an electronic component is picked up at an electronic component feeding part and then positioned and mounted at a predetermined mounting position on a transparent panel, mounting position marks formed at the mounting position on the transparent panel are registered with positioning marks formed on the electronic component, to thereby recognize the relative position from a surface opposite to a surface of the transparent panel where the electronic component is to be mounted, so that the position of the electronic component is corrected based on the result of the recognition before the electronic component is mounted at the predetermined mounting position on the transparent panel.

Method and apparatus for mounting electronic component

An apparatus, for applying a pressing tape to an object by applying pressure to the object, includes a pair of vertically movable members spaced at a certain interval. A tape-shaped material is traveled members and including a supporting tape carrying a pressing tape thereon. A pressure applying device is positioned between the movable members for pressing the tape-shaped member against an object. A tape feed-out device is provided upstream of one of the movable members for feeding out the tape-shaped material therefrom. A tape winding device is positioned downstream of the other movable member, for winding the tape-shaped material thereon. A tape feeding device is positioned between the other movable member and the winding device for feeding the tape-shaped material by a predetermined length by pulling the tape-shaped material. A first chuck is positioned on one movable member for chucking the tape-shaped material. A second chuck is positioned on the other movable member for chucking the tape-shaped material, and a third chuck device is provided for holding the tape-shaped material between the tape feeding device and the winding device.

Apparatus for applying tape to object by applying pressure thereto

A terminal component bonding apparatus is provided that has a stage for supporting a board having terminal components thereon, supporting the board. A pressure tool with a heater is set in a movable manner in a vertical direction above the stage so as to bond the terminal components to the board with heat and pressure. A shockless sheet is disposed along a lower surface of the pressure tool, and a pressing plate for terminal components is arranged along a lower surface of the shockless sheet and is made of a plate of a thermal expansion coefficient lower than that of the shockless sheet.

Bonding apparatus for terminal component

A TCP mounting apparatus includes a tool storing and holding section having arranged therein a plurality of different kinds of bonding tools which suction tape carrier packages of respective different shapes to heat and pressure bond the tape carrier packages to a liquid crystal panel. The bonding tools are stored at predetermined positions within the tool storing and holding section, and the tool storing and holding section includes a heater for heating the stored and held bonding tools and detector for detecting a presence and absence of the stored bonding tools at each position. A head part is also provided for extracting any selected one of the bonding tools stored and held in the tool storing and holding section. The head part also includes a heater for heating an extracted bonding tool. A conveyor mechanism moves and positions the head part to the predetermined positions of the tool storing and holding section.

Growing community of inventors

Toyonaka, Japan

Nobuhiko Muraoka