Mitsubishi Electric Corporation

Nobuchika Aoki

Rei Yoneyama

Keisuke Eguchi

Akihiko Yamashita

Hiroki Hidaka

Masayuki Ando

Hideki Tsukamoto

Yoshitaka Kimura

Akira Goto

Ren Kuga

A semiconductor power module in which a three-phase AC inverter is incorporated in a package includes first to third circuit patterns on which second, fourth, and sixth switching elements are mounted, respectively, and a fourth circuit pattern on which first, third, and fifth switching elements are mounted; a second main electrode to which all of main electrode wirings of the second, fourth, and sixth switching elements are connected; a second main electrode terminal connected to the second main electrode; a first main electrode electrically connected to the fourth circuit pattern; and a first main electrode terminal connected to the first main electrode, and each of the main electrode wirings of the second, fourth, and sixth switching elements is provided so that a main electrode wiring closer to the second main electrode terminal in a horizontal direction in plan view has a longer length.

Semiconductor power module and power conversion apparatus

A semiconductor module includes: a dissipating metal plate including a recess provided on an upper surface; an insulating substrate provided on a bottom surface of the recess and including a circuit pattern; a semiconductor device provided on the insulating substrate and connected to the circuit pattern; a case bonded to a peripheral portion on the upper surface of the dissipating metal plate and surrounding the insulating substrate and the semiconductor device; a case electrode provided on the case; a wire connecting the semiconductor device and the case electrode; and a sealant provided in the case and sealing the insulating substrate, the semiconductor device, and the wire, wherein a sidewall of the recess has a taper.

Semiconductor module

An object is to provide a semiconductor device capable of accurately detecting a temperature of a transistor part and a temperature of the diode part, and improving an overheat protection function. A semiconductor device includes a semiconductor chip having a cell region made up of a plurality of cells including cells corresponding to a transistor part and a diode part, respectively, a temperature detection part detecting a temperature of the transistor part, and a temperature detection part detecting a temperature of the diode part, the temperature detection part is disposed in the cell corresponding to the transistor part, and the temperature detection part is disposed in the cell corresponding to the diode part.

Semiconductor device

The object is to provide a semiconductor device that prevents a snapback operation and has excellent heat dissipation. The semiconductor device includes a semiconductor substrate, transistor portions, diode portions, a surface electrode, and external wiring. The transistor portions and the diode portions are provided in the semiconductor substrate and are arranged in one direction parallel with the surface of the semiconductor substrate. A bonding portion of the external wiring is connected to the surface electrode. The transistor portions and the diode portions are provided in a first region and a second region and alternately arranged in the one direction. A first transistor width and a first diode width in the first region are smaller than a width of the bonding portion. A second transistor width and a second diode width in the second region are larger than the width of the bonding portion.

A semiconductor module includes a diode bridge circuit, a sensor configured to measure a current value of the diode bridge circuit, a current limiting circuit having an IGBT connected to the diode bridge circuit, and a protection circuit configured to switch ON and OFF the IGBT in accordance with the current value of the diode bridge circuit measured by the sensor.

Semiconductor module and power conversion apparatus having a diode bridge circuit and a protection circuit

A semiconductor apparatus includes: a case made of resin; an insert terminal including an external terminal portion embedded in the case and having a first terminal exposed from the case, and an internal terminal portion bent in a L shape with respect to a second terminal of the external terminal portion and having a first surface exposed from the case and an anchor part in close contact with the case; and a bonding wire bonded to the first surface of the internal terminal portion.

Growing community of inventors

Tokyo, Japan

Nobuchika Aoki