Nippon Shokubai Co., Ltd.

Taiyo Holdings Co., Ltd.

Nobuaki Otsuki

Toshio Awaji

Hiromichi Tanaka

Masatoshi Yoshida

Masao Arima

Keiji Yurugi

Motohiro Arakawa

Akihiko Fukada

Shouji Minegishi

Manabu Akiyama

A curable resin obtained by reacting a polybasic anhydride with a reaction product of an epoxy resin with a phenol compound having an alcoholic hydroxyl group and an unsaturated monobasic acid, wherein an epoxy resin having a softening point of 93&#xb0; C. or higher is used as the epoxy resin.

Curable resin and producing process therefor

A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90&#xb0; C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Solder resist, dry film thereof, cured product, and printed wiring board

It is an object of the present invention to provide a compound having a (meth)acryloyl group that is suitably used in various applications, a process for producing such compound simply and under mild conditions, and an useful photo-curable composition and aqueous photo-curable composition comprising such compound. The present invention is related to a process for producing a compound having a (meth)acryloyl group

(Meth) acryloyl group-containing compound and method for producing the same

The photo-curable liquid solder resist ink composition of the present invention mainly comprises a photo-polymerizable resin having sufficient molecular weight and (meth)acryloyl groups which are imparted by both of introduction of (meth)acryloyl groups into a novolak-type epoxy resin having 4 or more of benzene nuclei and polymerization using a chain-extension agent. The composition is useful for a photo-curable type resist, since it can produce a coated film excellent in tack free characteristic and resolution, and can produce a cured film excellent in heat resistance, adhesiveness, and chemical resistance. In addition, by reacting with an acid anhydride, development with alkalis becomes possible.

Solder resist ink composition of a novolak-epoxy resin

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Suita, Japan

Nobuaki Otsuki