Hitachi, Ltd.

Hitachi Techno Engineering Co., Ltd.

Nobuaki Ooki

Kiyonori Kogawa

Masami Kawaguchi

Akira Nagai

Haruo Akahoshi

Motoyo Wajima

Akimi Miyashita

Ritsuji Toba

Hideyasu Murooka

Mutsumasa Fujii

Masayuki Kyooi

Keiichiro Torii

Minoru Kubosawa

Yuuzi Takada

Satoshi Yoshitomi

The present invention provides a printed circuit board which is high in acid resistance, mechanical strength at high temperature and bond strength, a method for making the printed circuit board and an apparatus used for making the printed circuit board. The technique of the present invention is characterized in that a metallic film having metal particles discretely distributed therein is provided on a roughened surface of copper circuit pattern on an insulating substrate which has been oxidized to form copper oxide and thereafter reduced.

Printed circuit board and method and apparatus for making same

A hot press including a displaceable sleeve for surrounding materials of a multi-layer substrate under a reduced pressure condition, a gas pressurizing condition and a heating condition with thermal plates. Upper and lower sealing units seal an interior of the sleeve, with a mechanism lowering and raising the sleeve. A pilot check mechanism prevents a lower bolster from raising/lowering upon the reduced pressure condition and the gas pressure condition, and a retainer maintains the lowered or raised condition of the sleeve. The multi-layer substrate is formed under the reduced pressure condition and the gas pressure condition. Accordingly, the atmosphere and moisture between the materials of the multi-layer substrate and volatile composition are removed. Additionally, a void generated during the heat and pressure process by the heating plates is eliminated from the multi-layer substrate. By carrying out the formation of the multi-layer substrate at the heat and pressure by the heating plates under the gas pressure condition, a final dimensional precision and shape are enhanced and a warpage or twist is suppressed.

Hot press

A method for treating the interior surfaces of holes as well as the surfaces of a perforated workpiece by dipping it into treating liquid includes a step of causing treating liquid to flow at both ends of the holes in a direction perpendicular to these holes at different velocities. In order to create these liquid flows at different velocities, the workpiece is dipped in the liquid so that the holes extend substantially horizontally, and air bubble jets are alternately delivered along both ends of the holes, or fins are provided at locations adjacent both ends of the holes so as to extend outwardly upwardly at one side of the hole ends and extend outwardly downwardly at the other side of the hole ends, and these fins are moved upwardly and downwardly.

Method for treating interior surfaces of holes and apparatus therefor

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Hadano, Japan

Nobuaki Ooki