Murata Manufacturing Co., Ltd.

Murata Mfg. Co., Ltd.

Nobuaki Kashiwagi

Tadahiro Nakagawa

Shizuma Tazuke

Satoshi Omuro

Kiyoshi Yoshida

Takashi Kimoto

Shigeo Hayashi

Hidemasa Iwami

Nobuyuki Hayashi

Naoyuki Mori

Toru Matsumura

A dipping machine has a chucking portion for engaging a holding plate to downwardly direct chip components, which are held by the holding plate, and a dipping vessel provided under the chucking portion, which is coated with a thin film of electrode paste. Conveyors horizontally transfer the holding plate holding the downwardly directed chip components, coated with the electrode paste, to a drying furnace. The drying furnace receives the holding plate holding the chip components downwardly and rotates the same by 360.degree. for drying the electrode paste. Thus, the as-formed electrodes have uniform widths on side surfaces of the chip components and the electrode paste is protected against adhesion of foreign matters such as dust, whereby it is possible to manufacture chip components with stable quality.

Electrode forming apparatus for chip type electronic components

A chucking portion (10) is supported at the lower part of a dip head portion (2) to be vertically movable in a horizontal state through four shafts. Two diagonally positioned two shafts 11a, 11b are formed by ball screws, and the other two (11c, 11d) serve as guide shafts. The dip head portion (2) contains a motor (12) for synchronously driving the two ball screws, and the chucking portion (10) horizontally engages a holding plate (A) holding a number of chip type electronic components (B) to downwardly direct the same. A dipping vessel (7) having a bottom surface which is coated with a thin film of paste is horizontally arranged under the dip head portion (2). Thus, it is possible to maintain the holding plate in parallel with the paste, for applying electrodes to the chip type electronic components with high accuracy.

Dipping apparatus

Pin head mounting members are rotatably mounted on a horizontal spindle above a table which horizontally supports a holding, plate holding chip type electronic components. The spindle is vertically movable by a vertical cylinder. Each pin head mounting member is shaped as a rectangular sleeve. A mounting surface is formed on each side portion of the pin head mounting member. A pin head each having a number of press pin is detachably mounted on each of the mounting surfaces A locking pin is provided on an upper end portion of the spindle for locking the pin head mounting members every 90.degree.. Thus, it is possible to efficiently replace press pins in response to a type change of chip type electronic components, as well as to quickly exchange a broken press pin.

Press machine for chip type electronic components

Growing community of inventors

Kyoto, Japan

Nobuaki Kashiwagi