Mitsui Toatsu Chemicals, Incorporated

Noboru Yamazaki

Yoshio Morimoto

Teruo Yuasa

Tsutomu Takase

Satoshi Numata

Kiyoshi Nakatani

Kunio Aoi

A process for preparing 2-(4'-hydroxyaryl)-2-(4'-aminoaryl)-propanes of the general formula ##STR1## wherein R represents a hydrogen or halogen atom or an alkyl, aryl, nitro, nitrile, acyl, acyloxy or amino group, R.sup.1 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R.sup.2 and R.sup.3, independently from each other, represent a hydrogen or halogen atom, a nitro group or an alkyl group having 1 to 4 carbon atoms, which comprises reacting (A) at least one isopropenyl phenol compound selected from the group consisting of isopropenyl phenol derivatives of the general formula ##STR2## wherein R is as defined, and di- to eicosa-mers of said isopropenyl phenol derivatives with (B) an aromatic amine of the general formula ##STR3## wherein R.sup.1 , R.sup.2 and R.sup.3 are as defined, in the presence of 0.00001 to 0.008 mole, per mole of said isopropenylphenol compound (A) calculated as a monomer, of a acid catalyst and in the presence or absence of a phenolic solvent.

Process for preparing 2-(4'-hydroxyaryl)-2-(4'-aminoaryl)-propanes

Indene compounds of the formula ##STR1## wherein X represents a hydrogen atom, a halogen atom, a hydroxyl group or a methyl group, and

Indene compound and novel process for producing indene compounds

Disclosed is a heat-resistant and fast-curing thermosetting resin composition suitably for insulating materials and comprising (a) a bismaleimide and/or a polymaleimide compound and (b) at least one compound selected from alkenylphenol derivatives, linear dimers thereof, and polymers thereof. In addition to components (a) and (b), this resin composition can contain (c) a polymerizable unsaturated compound.

Thermosetting resin composition from maleimide compound and alkenyl

The compositions composed by blending isopropenyl phenol linear polymers with epoxy resins containing at least two epoxy groups in one molecule, give cured products with excellent heat resistance and chemical resistance. With these compositions the curing speed is variable over an extremely broad range depending on the intended use, by optionally employing an accelerator.

Thermosetting resin compositions and the cured products thereof

A novel trimer of p-isopropenyl phenol of the structure ##STR1## which is useful as a material or a curing agent for epoxy resins. The linear trimer includes a cis-isomer (m.p. 225.5.degree.-227.degree. C.) and a trans-isomer (m.p. 167.degree.-168.degree. C.). It is prepared by reacting p-isopropenyl phenol or its linear polymer in the presence of an acid catalyst such as sulfuric acid, boron fluoride or activated clay in an aromatic hydrocarbon, halogenated hydrocarbon, substituted aromatic hydrocarbon or aprotic polar solvent (e.g., benzene, carbon tetrachloride, nitrobenzene or dioxane).

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Nagoya, Japan

Noboru Yamazaki