Jsr Corporation

International Business Machines Corporation

Noboru Yamahara

Hiroshi Ito

Yukio Nishimura

Tsutomu Shimokawa

Masafumi Yamamoto

Toru Kajita

Hiroyuki Ishii

Kiyoshi Murata

Haruo Iwasawa

Shinichiro Iwanaga

A radiation-sensitive resin composition comprising an acid-labile group-containing resin and a photoacid generator is disclosed. The resin has a structure of the formula (1),wherein Rrepresents a hydrogen atom, a monovalent acid-labile group, an alkyl group having 1-6 carbon atoms which does not have an acid-labile group, or an alkylcarbonyl group having 2-7 carbon atoms which does not have an acid-labile group, Xrepresents a linear or branched fluorinated alkyl group having 1-4 carbon atoms, and Rrepresents a hydrogen atom, a linear or branched alkyl group having 1-10 carbon atoms, or a linear or branched fluorinated alkyl group having 1-10 carbon atoms. The resin composition exhibits high transmittance of radiation, high sensitivity, resolution, and pattern shape, and is useful as a chemically amplified resist in producing semiconductors at a high yield.

Radiation-sensitive resin composition

The present invention provides a radiation sensitive resin composition which comprises (A) a resin represented by a copolymer comprising recurring units represented by the general formulae (1) or (2) as shown below, and (B) a radiation sensitive acid-generator. The radiation sensitive resin composition has an excellent storage stability and the resist produced from the composition is a chemically amplifiable type sensitive to radiations represented by fartificial ultraviolet rays. The resist has a high transparency to radiations and it is excellent in basic physical properties for resist such as durability to dry etching, sensitivity, resolution, and pattern configuration: 

Radiation sensitive resin composition

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Mie, Japan

Noboru Yamahara