Toyo Seikan Kaisha, Ltd.

Japan Crown Cork Co Ltd.

Kabushiki Kaisha Toshiba

Kabushiki Kaisha Tokuda Seisakusho

Noboru Suzuki

Isao Ichinose

Fumio Mori

Go Kunimoto

Munenori Iwami

Hidetaka Jyo

Reiichiro Sensui

Masahiro Shibagaki

Yuuki Yoneyama

Mitsuhiro Sakemoto

Shigeki Hazano

A method of washing a container,including charging a material to be contained into a container body having a mouth-and-neck portion; mounting a container closure on the mouth-and-neck portion of the container body, the container closure having a top panel wall, a cylindrical skirt wall extending downwardly from a peripheral edge of the top panel wall, and a washing liquid passage formed in at least one of an upper portion of the skirt wall and a peripheral edge portion of the top panel wall; and jetting a washing liquid at the container closure so that the washing liquid passes through the washing liquid passage and enters a space between the mouth-and-neck portion of the container body and the skirt wall of the container closure, thereby washing an outer peripheral surface of the mouth-and-neck portion of the container body and an inner peripheral surface of the skirt wall of the container closure. The washing liquid is at a temperature of 65&deg; C. to 70&deg; C. when the washing liquid is jetted at the container closure. Alternatively, the container closure is heated to 70&deg; C. or higher, and then the washing liquid of 45 to 70&deg; C. is jetted at the container closure.

Method for washing container

An apparatus for producing semiconductor devices in which a plurality of treatment chambers such as a load chamber, an etching chamber, a sputtering chamber, an ion implantation chamber, a CVD chamber, an unload chamber, a transfer chamber, a heat-treatment chamber, a rinsing chamber and the like, are connected in series preferably in the form of U for effecting various treatments of semiconductor wafers. Wafer conveyor and transfer means are provided to move a wafer through the treatment chambers in which the wafer is normally sequentially processed and these conveyor and transfer means are reversible so that a wafer which has been moved into a predetermined treatment chamber can be returned to the inlet of the apparatus, whereby the quantity of dust attached to the wafer in each treatment chamber can be easily and positively detected. In the heat-treatment chamber, the hot air is discharged against the upper surface of the wafer on the belt conveyor while a vertically movable heating plate is brought into contact with the undersurface of the wafer so that the uniform heat-treatment can be accomplished within a short period of time. Furthermore, the inner surfaces of the etching chamber or the like are lined with detachable linings made of, for instance, aluminum so that maintenance is facilitated.

Apparatus for producing semiconductor devices

A peelable adhesive structure is disclosed which comprises a plurality of parts at least one of which is made of metal, adhering together by means of a coating, characterized in that said coating has a peelable surface formed between a first layer of a denatured hydrocarbon resin or denatured hydrocarbon resin composition having an acid value of from 0.1 to 20 and a second layer containing an epoxy resin.

Peelable adhesive structure

A closure cap having a liner adhered to a cap shell by a plurality of coating layers. Prize markings are printed on one of the coating layers and are positioned between the coating layers. The peel resistance in the interface between the coating layers is less than that between the topmost coating layer and the liner to assure that the prize markings will be transferred to the liner when the liner is peeled from the cap shell. The liner includes a starting portion which adheres to the topmost coating layer only slightly to facilitate easy removal of the liner from the cap shell.

Closure cap having prize markings and peelable liner

A peelable bonded structure having a peel strength of 0.05 to 5 kg/cm comprises a plurality of articles, at least one of which is made of metal, bonded together through a composite coating layer. The composite coating layer is composed of adjacent first and second coating layers at least one of which comprises (A) a modified olefin resin having a carbonyl group concentration of 0.01 to 200 milliequivalents per 100 g of the olefin resin and (B) a coating film-forming base resin at an (A)/(B) weight ratio of from 0.2/99.8 to 40/60 and has a multi-layer distribution structure having resin concentration gradients in the thickness direction such that the modified olefin resin (A) is distributed predominantly in the portion contiguous to the interface between the two coating layers and the base resin (B) is distributed predominantly in the opposite portion.

Peelable bonded structures and process for preparing same

A container cap having a coated metal shell. A peelable adhesive layer joins a liner to the shell. The peelable adhesive layer comprises a local coating resin layer having a diameter less than that of the metal shell and a layer of an epoxy resin.

Container cap having a peelable liner

A crown closure having a polyolefin liner that can be readily removed, said crown closure comprising a crown shell having a primer layer on its inner surface and a polyolefin liner applied to the inside of said crown shell, characterized in that said primer layer is a two-component priming consisting of an undercoat layer containing a polyethylene oxide and a topcoat layer containing a polyethylene oxide and at least one other compatible resin, with the provision of a printing layer of indicia at the interface between said undercoat and topcoat layers or atop said topcoat layer. Aforesaid crown closure can be prepared by providing at one face of a metal stock sheet a primer undercoat layer containing a polyethylene oxide, printing indicia thereon, providing atop said undercoat layer a primer topcoat layer containing a polyethylene oxide and at least one other compatible resin, and thereafter forming said metal stock sheet into crown shells in such a manner that said coating layers come to the inside of the shells followed by depositing a polyolefin mass in said shells and molding same into the form of liners.

Growing community of inventors

Chigasaki, Japan

Noboru Suzuki