The Furukawa Electric Co., Ltd.

Noboru Sakuma

Shinichi Ishiwata

Yasumasa Morishima

Hiromitsu Maruyama

Shuzo Taguchi

A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/&#xb0; C. or less.

Growing community of inventors

Tokyo, Japan

Noboru Sakuma