Kabushiki Kaisha Nihon Micronics

Noboru Otabe

Yoshiyuki Fukami

Takayasu Sugai

Hiroshi Kamiya

Hidehiro Kiyofuji

Shou Harako

Toshinori Omori

Shogo Mizutani

An electrical connecting apparatus according to the present disclosure is characterized in including a first electrode region in which a liquid metal is filled in a first recessed part that is capable of conducting with a substrate electrode of a first wiring substrate, a second electrode region in which a liquid metal is filled in a second recessed part that is capable of conducting with a substrate electrode of a second wiring substrate opposing the first wiring substrate in a vertical direction, and a connector that causes conduction between the first electrode region and the second electrode region by bringing one end part into contact with the liquid metal of the first electrode region and bringing the other end part into contact with the liquid metal of the second electrode region.

Electrical connecting apparatus

Included are an insulating plateincluding a plurality of insulating synthetic resin layers, wiring circuits, andprovided in the insulating plate, a thin-film resistorformed to be buried in the insulating plateand electrically connected to the wiring circuits, and, a heat dissipating portionprovided over one surface of the insulating plate to be opposed to the thin-film resistorvia a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate, a pedestal portionformed to be buried in the insulating plateand provided to be opposed to the thin-film resistorvia a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portionand having higher heat conductivity than that of the insulating plate, and a heat dissipation and pedestal connecting portionconnecting the heat dissipating portionto the pedestal portionand having higher heat conductivity than that of the insulating plate

Multilayer wiring base plate and probe card using the same

Provided is a probe card with which the adjustment of height deviations of needle tip parts of probes and the adjustment of parallelism between the probes and an object to be inspected are simplified. The probe cardhas: a wiring substratehaving wiringtherein or on a surface thereof or the like; a plurality of probes; and a dielectric film. The dielectric filmis disposed to be spaced a distance away from a main surfaceof the wiring substrateat a position spaced away further from the wiring substratethan the needle tip partsof the probes, so that one surfaceof the dielectric filmfaces the needle tip partsand faces the main surfacethat is a probe installation surface of the wiring substrate. The probe cardconfigures a state in which the needle tip partsface an electrode of an object to be inspected with the dielectric filminterposed between the probe cardand the needle tip parts, during an inspection of the object to be inspected. An inspection signal supplied from an inspection device to the probesis set as an alternating current signal, and the probe cardcauses capacitive coupling between the needle tip partsand the electrode of the object to be inspected, and transmits the inspection signal.

Probe card

A multilayer wiring base plate includes an insulating plate including a plurality of synthetic resin layers made of an insulating material, a wiring circuit provided in the insulating plate, a thin-film resistor formed along at least one of the synthetic resin layers to be buried in the synthetic resin layer and inserted in the wiring circuit, and a heat expansion and contraction restricting layer formed to be buried in the synthetic resin layer adjacent to the synthetic resin layer in which the thin-film resistor is formed to be buried, arranged along the thin-film resistor, and having a smaller linear expansion coefficient than a linear expansion coefficient of the adjacent synthetic resin layers.

A method for manufacturing an electric film body is made by forming a film body to have a shape in accordance with a desired electric characteristic and includes a film forming process for forming an electric film body on a board layer, an electric characteristic measuring process for measuring an electric characteristic in a surface of the electric film body formed in the film forming process, an electric film body shape setting process for setting a shape of the electric film body based on the electric characteristic measured in the electric characteristic measuring process, and an electric film body forming process for forming the electric film body formed in the shape set in the electric film body shape setting process.

Growing community of inventors

Tokyo, Japan

Noboru Otabe