Murata Manufacturing Co., Ltd.

Murata Manufacturingco., Ltd.

Noboru Kato

Jun Sasaki

Satoshi Ishino

Yuya Dokai

Nobuo Ikemoto

Kuniaki Yosui

Katsumi Taniguchi

Masahiro Ozawa

Ikuhei Kimura

Shinichi Nakano

Teppei Miura

Satoshi Sasaki

Kunihiro Komaki

Kenichi Ishizuka

Shigeru Tago

Noriyuki Ueki

Hiromi Murayama

Koji Shiroki

Nobuhito Tsubaki

Takeshi Kataya

Sadayuki Matsumura

Makoto Yasutake

Atsushi Tojyo

Ryohei Omori

Mikiko Saito

Toshiyuki Nakaiso

Naoto Ikeda

Kazuaki Higashibata

Masato Nomura

Takashi Noma

Harufumi Mandai

Takahiro Baba

Hirokazu Yazaki

Yuki Wakabayashi

Tsuyoshi Mukai

Makoto Takeoka

Junichi Kurita

Yoichi Saito

Kosuke Yamada

Ryosuke Washida

Naoki Gochi

Hiroko Nomura

Yoshinori Yamawaki

Hiroyuki Kubo

Naoki Gouchi

Shinichiro Banba

Kimikazu Iwasaki

Koji Nosaka

Hisashi Akiyama

Bunta Okamoto

Kazuki Eshima

Takeshi Kurihara

Mikiko Tanaka

Norio Sakai

Yutaka Sasaki

Hiroshi Nishida

Mitsuyoshi Nishide

Tsutomu Ieki

Makoto Osamura

Yasuko Yoshinaga

Emiko Nogome

Teruhisa Tsuru

Hiromitsu Ito

Tetsuo Taniguchi

Hisatake Okamura

Tsuyoshi Suesada

Nobuyuki Tenno

Ken Tonegawa

Hiroshi Masuda

Kosuke Nakano

Shinji Goma

Kanto Iida

Hirotaka Fujii

Kenji Kubota

Hiromasa Koyama

Wataru Tamura

Akihiro Ochii

Shunsuke Chisaka

Fumie Matsuda

Hiroshi Somada

Yutaka Masuda

Tsuneo Murata

Yoshihiro Aoyama

Shunji Mandai

Ken Sakai

Yoshiki Aburatani

Hiroaki Tsumori

Mikiko Kimura

Tatsuya Ito

Tatsuya Ochi

Junishi Kurita

Jo Onodera

Shigeyuki Shioya

Noriaki Tsukada

Miki Sasamura

Hideshi Yamada

Kouji Nosaka

Hiroyuki Imanishi

A container including an RFID module is provided that includes a base, and an antenna pattern. The antenna pattern includes a first antenna film and a second antenna film on a first main surface of the base. The RFID module includes an RFIC element, a filter circuit, and first and second electrodes. The filter circuit is configured to transmit a current due to an electromagnetic wave at a natural resonance frequency to the RFIC element. The first and second electrodes are connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected to each other. The second electrode of the RFID module and the second antenna film are electrically connected to each other. Moreover, a sheet resistance of each of the first antenna film and the second antenna film is 0.5Ω/sq or more.

Container provided with RFID module and method for manufacturing container provided with RFID module

A wireless communication device manufacturing system includes: a mounting apparatus including a mounting head mounted with a suction nozzle that sucks and holds an RFIC module including an RFIC chip, a terminal electrode, and a hot melt adhesive layer; a conveyance apparatus configured to convey the antenna base material including an antenna pattern to a mounting position; and a heating apparatus configured to heat the hot melt adhesive layer of the RFIC module. The wireless communication device manufacturing system bonds the RFIC module in a state where the hot melt adhesive layer is softened by heating of the heating apparatus to the antenna base material disposed at the mounting position through the hot melt adhesive layer, and capacitively couples the antenna pattern and the terminal electrode through the hot melt adhesive layer.

Wireless communication device manufacturing system

A communication device for communicating with wireless communication devices is provided that includes a shield device defining a plurality of shield spaces arranged along a transport path transporting a sheet on which a plurality of wireless communication devices are arrayed; and a plurality of reader/writer antennas arranged in each of the plurality of shield spaces. Moreover, the plurality of shield spaces are juxtaposed corresponding to an array pitch between the wireless communication devices on the sheet, a part of the shield device is arranged between the plurality of reader/writer antennas, and the plurality of reader/writer antennas are arranged at a side facing a transport surface of the transport path.

Communication apparatus and communication method

An IC module is provided that includes an IC having a terminal electrode, and a substrate having a first surface and a second surface opposite to each other and having a land formed on the first surface. Moreover, the land is connected to the terminal electrode of the IC. On the first surface of the substrate, an insulator layer that covers an area outside of a formation area of the land is formed. A difference between a thickness of the insulator layer and a thickness of the IC is smaller than a difference between the thickness of the insulator layer and a thickness of the substrate, and the thickness of the substrate is smaller than the thickness of the insulator layer.

IC module and method of manufacturing IC module

A container including an RFID module is provided that includes a base, a metal film, and a slit. The base has an insulating property. The metal film is on a first main surface of the base. The slit separates the metal film into a first metal region and a second metal region. The RFID module includes an RFIC element, a filter circuit configured to transmit a current due to an electromagnetic wave at a natural resonance frequency being a communication frequency to the RFIC element, and first and second electrodes to be connected to the filter circuit. The first electrode of the RFID module and the first metal region of the metal film are electrically connected to each other. The second electrode of the RFID module and the second metal region of the metal film are electrically connected to each other.

Container including RFID module

An electronic device is provided with an electronic component having a base material and a terminal electrode formed on a first surface of the base material, and a circuit substrate in which a pad for mounting the electronic component is formed on a first surface. A hole for light transmission is formed in the pad, and the pad and the terminal electrode are electrically and mechanically connected to each other with a cured product of optical firing paste obtained by receiving light from a second surface that is a surface opposite to the first surface of the circuit substrate.

Electronic device and method for manufacturing the same

An RFID auxiliary antenna device is provided on an article that is adjacent to an RFID tag to be communicated or accommodates the RFID tag. The RFID auxiliary antenna device includes a conductive pattern that circles the article. A capacitance component generated between conductive patterns and an inductance component of the conductive pattern configure a resonant circuit. A resonant frequency of the resonant circuit is equal to or substantially equal to a communication frequency of the RFID tag, and the RFID auxiliary antenna device is magnetically coupled to each of the RFID tag and a reader/writer.

RFID auxiliary antenna device

A wireless communication device is provided that includes an RFIC module having an RFIC chip and first and second terminal electrodes connected to the RFIC chip. An antenna member is provided that includes an antenna pattern having first and second coupling portions and an antenna base material on which the antenna pattern is disposed. Moreover, an insulating sticky layer is disposed between the RFIC module and the antenna member, and is provided for bonding the RFIC module to the antenna member. The first terminal electrode and the first coupling portion are capacitively coupled, with the sticky layer in between, and the second terminal electrode and the second coupling portion are capacitively coupled, with the sticky layer in between.

Wireless communication device

An RFID tag manufacturing system is provided that includes a conveyance device that conveys a base sheet provided with a plurality of antenna patterns to each of which an RFIC module is fixed. The system includes a laminating device that attaches a cover seal on the base sheet to cover the antenna patterns and a punching device that produces RFID tags by punching the cover seal and the base sheet with a punching blade that includes a frame-shaped cutting edge surrounding the antenna patterns to form a frame-shaped cut. The base sheet includes alignment mark in a non-attachment part of the cover seal. The punching device specifies the position of each of the antenna patterns covered with the cover seal based on the alignment mark, and punches the cover seal and the base sheet based on the specified position of the antenna pattern.

RFID tag manufacturing system

An RFID reader/writer antenna device is provided that includes a first radiating element, a second radiating element, a third radiating element, baluns, a phase shifter, and a distributor. The radiating elements each comprise conductor patterns with extending directions that are parallel to each other, and used for reading or writing of RFID tags. The distributor connects the first radiating element, the second radiating element, and the third radiating element to a common input/output. The phase shifter causes a feeding phase of the second radiating element and feeding phases of the first radiating element and the third radiating element to have a phase difference of 90°. The baluns perform conversion between a balanced signal and an unbalanced signal.

RFID reader/writer antenna device

A wireless communication device transmits and receives a high-frequency signal having a first frequency as a carrier frequency. The device includes a base material made of paper, an antenna pattern of an Sn alloy formed on the base material, and an RFIC element connected electrically to the antenna pattern. Moreover, the antenna pattern including a thin wire part and a thick wire part that differ in wire width from each other.

An RFIC module is provided that includes a base material having a first face and a second face opposite to each other, an RFIC mounted above the first face of the base material, and RFIC-side terminal electrodes that are formed on the first face of the base material and are connected to the RFIC. An insulator film is formed on the surface of the RFIC-side terminal electrode, and conductor films facing the RFIC-side terminal electrode are formed on the insulator film. Moreover, additional capacitances are formed between the RFIC-side terminal electrodes and the conductor films.

RFIC module and RFID tag

An RFIC module is provided that includes a base material having a first surface and a second surface opposite to each other; an RFIC mounted on a first surface side of the base material; a first conductor pattern formed on the first surface of the base material; a first insulator film formed on the first surface of the base material and a surface of the first conductor pattern; a second conductor pattern formed on the first insulator film and the first conductor pattern; and a second insulator film covering a surface side of the base material with respect to the first surface. Moreover, the first and second conductor patterns form a circuit connected between RFIC-side electrodes to which the RFIC is connected and antenna-side electrodes facing an antenna conductor pattern.

A material sheet is provided having antenna patterns that include first and second coupling portions that are transported toward a mounting position, and an adhesive member that is disposed on the material sheet before reaching the mounting position. At a pickup position, a mounting device picks up an RFIC module including an RFIC chip and first and second terminal electrodes connected to the RFIC chip. At the mounting position, the mounting device mounts the picked-up RFIC module onto the adhesive member on the material sheet so that the first coupling portion and the first terminal electrode face each other and so that the second coupling portion and the second terminal electrode face each other.

Wireless communication device manufacturing method and wireless communication device manufacturing apparatus

A wireless communication device is provided for transmitting and receiving a high-frequency signal having a first frequency for communication is disclosed. The device includes a loop pattern having a first electrode and a second electrode as both ends, an antenna pattern, a third electrode capacitively coupled to the first electrode, and a fourth electrode capacitively coupled to the second electrode. The device includes an RFIC having a capacitive impedance at a second frequency higher than the first frequency, and a first current path and a second current path connected in parallel with each other between the third electrode and the fourth electrode. The RFIC is included in the first current path and the second current path has an inductive impedance at a second frequency.

Wireless communication device using a radio frequency identification (RFID) technology for data communication in a non-contact manner by an induction electromagnetic field or a radio wave

Growing community of inventors

Nagaokakyo, Japan

Noboru Kato