Nsk Corporation

Kabushiki Kaisha Daini Seikosha

Kirin Brewery Company, Limited

Seiko Instruments & Electronics Ltd.

Noboru Kaneko

Osamu Miyoshi

Takashi Sunaga

Junichi Tabata

Masakazu Morimoto

Ryoichi Suzuki

Tatsushi Oosawa

Hideo Oota

Shin Kumagai

Kenichi Kondo

Teruyuki Sakai

Shojiro Komaki

Tadayoshi Osakabe

Yasuhiro Shimizu

Zhipeng Tu

Yuri Shimizu

Makoto Takeishi

Tatsuo Nakajima

Ryuichi Kuronuma

Kazuhito Nishio

Takashi Nakamura

Kouji Akimoto

An electronic control device includes: a circuit board including a substrate and an electrolytic capacitor connected to the substrate; a heat sink including a recess that houses the electrolytic capacitor; and heat dissipation material provided in the recess. The electrolytic capacitor has an end surface facing a bottom surface of the recess, and the heat dissipation material is in contact with the end surface and the bottom surface.

Electronic control device and steering device

Motor with controller for power steering

A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.

Structure of substrate having electronic parts mounted thereon and case for housing the substrate

Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein said rising portion is formed as to have an obtuse angle from said solder coupling portion regardless of a bending angle of said vertical portion with respect to said solder coupling portion.

Multipolar lead parts and board coupling device

A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

Resistance welding device and resistance welding method

To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Semiconductor module

To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module () includes substrate () made of metal, an insulating layer () formed on the substrate (), a plurality of wiring patterns (to) formed on the insulating layer (), a bare-chip transistor () mounted on a wiring pattern () via a solder (); and a metal plate connector () jointing an electrode (S, G) of the bare-chip transistor () and a wiring pattern () via a solder (). The metal plate connector () has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width Wof the electrode jointing portion in a direction perpendicular to one direction is smaller than the width Wof the substrate jointing portion in the direction perpendicular to the one direction.

A semiconductor module is provided for shortening a manufacturing tact time, reducing manufacturing costs and for ensuring reliability of a bonding portion. The semiconductor module includes a substrate formed of a metal, an insulating layer formed on the substrate, a plurality of wiring patterns formed on the insulating layer, a bare-chip transistor mounted on one wiring pattern via a solder, and copper connectors that connect electrodes formed on the bear-chip transistor and other wiring patterns via a solder. The copper connectors have a bridge shape, have a width-reduced portion formed in the vicinity of the bonding face to the electrodes, and have a stress-reducing portion formed on the bonding face bonded to the electrode.

A multipolar connector is provided. It is possible to prevent deformation of a particular pin-shaped terminal of plural pin-shaped terminals arranged in a line in a direction perpendicular to a connection direction of the multipolar connector, and also possible to prevent positional displacements of the particular pin-shaped terminal and other pin-shaped terminals. The multipolar connector () includes plural pin-shaped terminals () arranged in a line in a direction (arrow X direction) perpendicular to a connection direction (arrow Y direction) of the multipolar connector to extend in the connection direction, and a hold member () configured to extend in the direction perpendicular to the connection direction and hold the plural pin-shaped terminals () at a predefined pitch.

Multipolar connector

There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.

Semiconductor module and method for manufacturing the same

The present invention relates to use of compounds represented by the following general formula [1] or salts or prodrugs thereof:[where Rrepresents hydrogen atom or lower alkoxy group; Rrepresents hydrogen atom, lower alkoxy group, optionally substituted phenyl group,(where Rrepresents acyl group); X represents &#x2014;CO&#x2014; or &#x2014;CH&#x2014;; and n-represents 1 or 2], as drugs for overcoming a resistance to anticancer drugs or drugs for enhancing an effect of anticancer drugs. The compounds represented by the general formula [1] have not only a function of overcoming the resistance to various anticancer drugs but also a function of enhancing the effect of various anticancer drugs to anticancer-drug sensitive cells. Thus, these compounds have excellent effects on resistant cells and also on sensitive cells, and in particular effective in the treatment of a cancer having an acquired resistance to an anticancer drug.

Use of 1,4-benzothiazepine derivatives as drugs for overcoming resistance to anticancer drugs

1,4-benzothiazepine derivatives

Diphenylmethyl piperazine derivatives

An electronic timepiece provided with an electrochromic display device as a time related information display. The ECD is driven by an electric charge transfer method. The electric charges which cause coloration of segments directly transfer from non-selected segments to selected segments. In the ECD additional concealed dummy segments temporally store the excess electric charges when the total area of the selected segments decreases, and release the stored electric charges when the total area of the selected segments increases, so that the electric charge density of colorized segment is always kept constant. Moreover electric charges are periodically supplied to the display device so as to compensate the lost amount which was dissipated during transfer cycle.

Growing community of inventors

Tokyo, Japan

Noboru Kaneko