Fujitsu Corporation

Fujitsu Semiconductor Limited

Fujitsu Microelectronics Limited

Towa Corporation

Noboru Hayasaka

Eiji Yoshida

Kazuo Teshirogi

Yuzo Shimobeppu

Kazuhiro Yoshimoto

Yoshiaki Shinjo

Mitsuhisa Watanabe

Naoyuki Watanabe

Toshiyuki Honda

Susumu Moriya

Izumi Kobayashi

Toru Nishino

Yoshito Akutagawa

Kouichi Meguro

Shinji Takase

Osamu Nakagawa

Hiroshi Uragami

Koichi Meguro

Kinya Fujino

Hideki Tokuyama

To provide an image pickup apparatus with excellent optical characteristics as well as high reliability and a method of manufacturing the same, capable of efficiently manufacturing the image pickup apparatus in large quantities. The image pickup apparatus of the present invention includes a support board, an image pickup devicemounted on the support board, and a lens componentprovided on the light receiving region of the image pickup device, wherein the lens componenthas a protrusion partprovided around the lens part, and the height of the protrusion partfrom the surface of image pickup deviceis greater than that of the topA of lens partfrom the surface of the image pickup device

Image pickup apparatus and method of manufacturing the same

A method of resin sealing an electronic part, includes the steps of: providing a board where one or more of the electronic parts are mounted in an upper mold; melting a resin material received in a cavity forming part of a lower mold; and dipping the electronic part held by the upper mold into the molten resin so that the resin sealing is achieved. The resin material is received in the cavity forming part of the lower mold after the resin material is pressurized and dispersed in a sealing resin supply apparatus.

Method of resin sealing electronic part

The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame, and a rubber filmarranged within the outer frameand having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber filmincreases, the wafer-fixing jigdeforms the rubber film and allows the tapesandarranged between the waferand the rubber filmA to be pushed toward the wafergradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Vacuum fixing jig for semiconductor device

The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame, and a rubber filmarranged within the outer frameand having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber filmincreases, the wafer-fixing jigdeforms the rubber film and allows the tapesandarranged between the waferand the rubber filmA to be pushed toward the wafergradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Jig for a semiconductor substrate

A substrate sheet material for semiconductor device and manufacturing method thereof and a manufacturing method of a semiconductor device using the substrate sheet material can suppress and reduce a warp which may occur in the substrate sheet material even when a plurality of semiconductor chips formed in the substrate sheet material are molded all at once. A plurality of substrates to be used for producing semiconductor packages are formed in the substrate sheet material. An outer configuration of the substrate sheet material is made into a circular shape.

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Method of manufacturing a semiconductor device and a method for fixing the semiconductor device using substrate jig

First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a cavity formed in the lower mold is fitted in the cavity. Thereafter, the resin material is heated resulting in melted resin. Thereafter, the lower mold and the upper mold are closed, with a space formed by the upper mold and the lower mold being reduced in pressure. As a result, chips and wires are immersed in the melted resin. Thereafter, the melted resin is set, so that a resin mold product including the board and the set resin is formed.

Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material

A method of making a semiconductor device includes a back-grinding step of grinding a back surface of a semiconductor substrate, a dicing step of dicing the semiconductor substrate along predetermined dicing lines so as to make pieces of semiconductor devices after the back-grinding step, and a laser exposure step of shining laser light on the back surface of the semiconductor substrate after the back-grinding step so as to remove grinding marks generated by the back-grinding step.

Method of making semiconductor device that has improved structural strength

The present invention relates to a method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer; and to a semiconductor substrate jig used in such method. The object of the present invention is to mitigate the effect and to prevent damage caused by the lack of strength in thinned semiconductor substrates. A jig with an outer frame , and a rubber film arranged within the outer frame and having increasing and decreasing body size while deforming its shape by supplying air therein are provided. As the volume of the rubber film increases, the wafer-fixing jig deforms the rubber film and allows the tapes and arranged between the wafer and the rubber film A to be pushed toward the wafer gradually from the center outward. The attachment step, the back grind step, the tape reapplication step, the pick up step and the die bonding step are conducted using such wafer-fixing jig.

Growing community of inventors

Kawasaki, Japan

Noboru Hayasaka