Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Other

No Sun Park

Jin Young Kim

Sung Kyu Kim

Se Woong Cha

Yoon Joo Kim

Seung Jae Lee

Ju Hoon Yoon

Jong Sik Paek

Glenn A Rinne

Byong Jin Kim

Ji Young Chung

Choon Heung Lee

Jin Han Kim

Jae Min Bae

Hyung Il Jeon

In Bae Park

Ji Yeon Ryu

Young Suk Chung

Jae Beom Shim

Kwang Sup So

Go Woon Jung

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 μm or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

Electronic device package and fabricating method thereof

A semiconductor device structure and a method for manufacturing a semiconductor device. As a non-limiting example, various aspects of this disclosure provide a semiconductor device structure (e.g., a sensor device structure), and method for manufacturing thereof, that comprises a three-dimensional package structure free of wire bonds, through silicon vias, and/or flip-chip bonding.

Semiconductor package and manufacturing method thereof

The system for operating a match-up game includes a display unit having a plurality of player screen regions configured to display game screens a first input unit configured to receive an input from a first player a second input unit configured to receive an input from a second player a first air outlet configured to discharge air to the first player a second air outlet configured to discharge air to the second player; a control unit configured to control the display unit to count a game time and change the game screens displayed on the player screen regions for each counted game time, and when receiving an input to the first input unit from the first player, control the second air outlet so as to discharge air corresponding to the received input. The system for operating a match-up game may increase a player's sense of immersion.

System and method for operating match-up game

Various aspects of the present disclosure provide a semiconductor device, for example comprising a finger print sensor, and a method for manufacturing thereof. Various aspects of the present disclosure may, for example, provide an ultra-slim finger print sensor having a thickness of 500 &#x3bc;m or less that does not include a separate printed circuit board (PCB), and a method for manufacturing thereof.

A semiconductor package and manufacturing method thereof are disclosed and may include a first semiconductor device comprising a first bond pad on a first surface of the first semiconductor device, a first encapsulant material surrounding side edges of the first semiconductor device, and a redistribution layer (RDL) formed on the first surface of the first semiconductor device and on a first surface of the encapsulant material. The RDL may electrically couple the first bond pad to a second bond pad formed above the first surface of the encapsulant material. A second semiconductor device comprising a third bond pad on a first surface of the second semiconductor device may face the first surface of the first semiconductor device and be electrically coupled to the first bond pad on the first semiconductor device. The first surface of the first semiconductor device may be coplanar with the first surface of the encapsulant material.

In one embodiment, an electronic package structure includes a lead having a first width. An electronic chip having a conductive bump on a major surface, the conductive bump has a second width greater than the first width. The conductive bump is attached to the lead such that a portion of the conductive bump extends to at least partially surround a side surface of the lead. A molding compound resin encapsulates the electronic chip, the conductive bump, and at least a portion of the lead. The lead is configured so strengthen the joining force between the lead and conductive bump.

Semiconductor package and method therefor

Package of finger print sensor and fabricating method thereof

Growing community of inventors

Gwangju-si, South Korea

No Sun Park