Hewlett-packard Development Company, L.p.

Nitin C Bhagwath

Sachin Navin Chheda

Robert William Dobbs

Naysen J Robertson

Kirk Yates

Andrew Chau

A component for insertion into a hole in a multiple-layer substrate enables impedance matching of the substrate. The component comprises a conductive ground core arranged to extend through multiple-layers of the substrate when the component is inserted, a dielectric layer laterally encasing the conductive ground core, and a signal conductor layer coupled lateral to the dielectric layer.

Component for impedance matching

A fan controller in one exemplary embodiment facilitates control over a cooling system having fans in a computing apparatus, and permits operating system and application program based software inputs as well as hardware inputs to be utilized in the control of the fans.

Multifunctional control of cooling systems for computers

A plurality of conductive pads of an apparatus in one example are disposed on a circuit board in a predetermined arrangement compatible with an arrangement of probes on an external test connector. One or more of the plurality of conductive pads is disposed on an embedded layer of the circuit board.

Arrangement with conductive pad embedment

Methods and systems for testing devices in a scan chain are described. A first device for test and a second device for test are coupled in the scan chain. A signal selector is coupled between the first and second devices. The signal selector selects between an output signal that is output from the first device and a bypass signal that has bypassed the first device.

Growing community of inventors

Lincoln, CA, United States of America

Nitin C Bhagwath