Purdue Research Foundation

Ima Life North America Inc.

Nithin Raghunathan

Dimitrios Peroulis

Rahim Rahimi

Jose Waimin

Sarath Gopalakrishnan

Ernesto Renzi

Alina Alexeenko

Francis W Demarco

Arnab Ganguly

Petr Kazarin

Xiaofan Jiang

A virtual thermocouple system for non-invasively predicting product characteristics is disclosed, which includes one or more temperature sensing systems including a resistive network which includes a temperature sensing device comprising a plurality of negative temperature coefficient (NTC) thermistors, and a load resistor, a corresponding system-on-chip coupled to a corresponding resistive network and configured to i) power the corresponding resistive network, ii) receive corresponding signals from each NTC thermistor of the corresponding temperature sensing device, iii) process the signal associated with each NTC thermistor of the corresponding temperature sensing device and thus generate data associated with each NTC thermistor, and iv) transmitting the processed data, a power generating device configured to provide power to the corresponding system-on-chip, and a base stations adapted to i) receive the processed data from a corresponding system-on-chip, and ii) using a predefined model, and non-invasively translate the processed data to thermal characteristics of a product.

Method and system for non-invasively monitoring product temperature in controlled lyophilization

A batteryless, chipless, sensor is disclosed which includes a substrate, at least two conductive strips disposed on the substrate, a passivation layer encasing the substrate and the at least two conductive strips, wherein the conductive strips are adapted to respond to an interrogation signal from a reader having a first polarization, with a response signal at a second polarization different than the first polarization.

Subsoil moisture monitoring system including battery-less wireless chipless sensors

An arrangement for monitoring a freeze drying process includes product condition sensors for product condition measurement within product vials. The product condition sensors are bimetal junctions deposited on a substrate using an ink jet printing process. The substrate may be a flexible film applied to an interior surface of the product vial, or may be the vial surface itself. The bimetal junction may be printed using a roll-roll inkjet printing process with metallic nanoparticle inks. Multiple closely-spaced bi-metal junctions are provided in each measurement vial. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The location of a sublimation front may be calculated for each measured vial, and the freeze drying process may be controlled using the data.

Process control using non-invasive printed product sensors

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West Lafayette, IN, United States of America

Nithin Raghunathan