Intel Corporation

International Business Machines Corporation

Other

Nirupama Chakrapani

Vijay Wakharkar

James Chris Matayabas, Jr

Sampath Purushothaman

Matthew Earl Colburn

Dirk Pfeiffer

Christos Dimitrios Dimitrakopoulos

Satyanarayana Venkata Nitta

Lakshmi Supriya

Shankar Ganapathysubramanian

Chris Matayabas

Leonel R Arana

Jorge A Sanchez

Dingying David Xu

Nisha Ananthakrishnan

Mohit Mamodia

Shripad Gokhale

Gregory S Constable

Jinlin Wang

Gopalakrishnan Subramanian

Larry DeCesare

Jason Murphy

Wen Feng

Janet Feng

A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarity, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

Controlled fluid delivery in a microelectronic package

A microelectronic package includes a die which may include MEMS and CMOS circuitry for analyzing a fluid. A defined path is provided for channeling fluid to the die. Rather than patterning depressions or physical channels in the package substrate, the defined paths comprise coatings that may channel the flow of liquids to the die for biological sensor type applications. The defined paths may comprise a wetting coating that has an affinity to fluids. Similarly, the defined paths may comprise a dewetting coating the tend to repel fluid surrounding the paths.

A treatment for a microelectronic device comprises a dicing tape () and a polymer composite film () having a pigment or other colorant added thereto and, in some embodiments, a pre-cure glass transition temperature greater than 50&#xb0; Celsius. The film can comprise multiple layers, with one layer being tacky and the other layer non-tacky at a given temperature.

Treatment for a microelectronic device and method of resisting damage to a microelectronic device using same

Spreading or keep out zones may be formed in integrated circuit packages by altering the roughness of package surfaces. The surface roughness can be altered by applying or growing particles having a dimension less than 500 nanometers. Hydrophilic surfaces may be made hemi-wicking and hydrophobic surfaces may be made hemi-wicking by particles of the same general characteristics.

Electronic packages with fine particle wetting and non-wetting zones

Applications of smart polymer composites to integrated circuit packaging.

Applications of smart polymer composites to integrated circuit packaging

A microelectronic package is provided. The microelectronic package includes a semiconductor substrate and a die having a top surface and a bottom surface, wherein the bottom surface of the die is coupled to the semiconductor substrate. The microelectronic package also includes a nanomaterial layer disposed on the top surface of the die.

Microelectronic package with wear resistant coating

Methods and apparatus to control surface properties via colloidal coatings are described. In one embodiment, colloidal coating may be used on a surface to enhance flow control. Other embodiments are also described.

Controlling substrate surface properties via colloidal coatings

Often used to reduce the RC delay in integrated circuits are dielectric films of porous organosilicates which have a silica like backbone with alkyl or aryl groups (to add hydrophobicity to the materials and create free volume) attached directly to the Si atoms in the network. Si&#x2014;R bonds rarely survive an exposure to plasmas or chemical treatments commonly used in processing; this is especially the case in materials with an open cell pore structure. When Si&#x2014;R bonds are broken, the materials lose hydrophobicity, due to formation of hydrophilic silanols and low dielectric constant is compromised. A method by which the hydrophobicity of the materials is recovered using a novel class of silylation agents which may have the general formula (RN)SiR'where X and Y are integers from 1 to 3 and 3 to 1 respectively, and where R and R&#x2032; are selected from the group of hydrogen, alkyl, aryl, allyl and a vinyl moiety. Mechanical strength of porous organosilicates is also improved as a result of the silylation treatment.

Recovery of hydrophobicity of low-k and ultra low-k organosilicate films used as inter metal dielectrics

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Chandler, AZ, United States of America

Nirupama Chakrapani