General Electric Company

General Electric Corporation Gmbh

Nirajkumar Chaturbhai Patel

Kazunao Kubotera

John Jeffrey Talley

John Robert Campbell

Johannes Martinus Dina Goossens

James Ross Fishburn

Hendrik Verhoogt

Richard Lucas

Neal Steven Falcone

Luc Govaerts

Matthew Ladd Reitz

A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 &#x3bc;m. Fiber reinforced and flame retarded compositions exhibit high HDT values.

High flow polyphenylene ether formulations

Carbon fiber-filled PC-ABS resin compositions which have improved electrical properties at a given level of carbon fibers, and which do not suffer from as significant a decrease in impact strength as would result from the introduction of generic carbon fibers are achieved using carbon fibers treated with a polyamide terpolymer binder. The bundles are dispersed within the PC-ABS blend. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include, but are not limited to electronic devices, dust handling equipment and notebook computer enclosures.

Carbon-reinforced PC-ABS composition and articles made from same

Fire retardant polyphenylene ether-organoclay composition and method of making same

A high flow polyphenylene ether resin composition with improved HDT values and flame retardance comprising a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.25 dl/g and preferably having a particle size of at least about 100 &mgr;m. The composition preferably contains less than 30 wt % of the low viscosity polyphenylene ether based on the weight of the total composition. Fiber reinforced and flame retarded compositions also exhibit high HDT values.

Carbon fiber-filled, thermoplastic resin compositions having improved electrical properties at a given level of carbon fibers are formed from thermoplastic resin and carbon fibers associated into bundles with a binder. The thermoplastic resin and the binder are selected to be incompatible such that the adhesion of the fiber to the resin is poor. An exemplary composition is formed from a thermoplastic polymer selected from among polystyrene, high impact polystyrene, polycarbonate, polybutylene terephthalate, polyethylene terephthalate, polyphenylene ether, polyether imide and blends thereof; and carbon fibers associated into bundles with a polyamide terpolymer binder. The bundles are dispersed within the thermoplastic polymer. The compositions can be used for injection molding of articles for use as components in applications requiring static dissipation and/or EMI shielding. Such articles include electronic devices, dust handling equipment and notebook computer enclosures.

Carbon-reinforced thermoplastic resin composition and articles made from same

The present invention provides resin compositions comprising a thermoplastic resin and at least one phosphoramide having a glass transition point of at least about 0&deg; C., preferably of at least about 10&deg; C., and most preferably of at least about 20&deg; C. The present invention also relates to articles made from the resin compositions. The present invention also provides methods to make the resin compositions-having improved heat properties over compositions known in the art.

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Stamford, CT, United States of America

Nirajkumar Chaturbhai Patel