Applied Materials, Inc.

Gas Research Institute

Other

Applied Materials Israel Limited

Applied Materials, Inc.—robotics

Nir Merry

Jeffrey C Hudgens

Dean C Hruzek

Paul Benjamin Reuter

John C Menk

Michael Robert Rice

Sushant Suresh Koshti

Douglas Brian Baumgarten

Wolfgang R Aderhold

Larry A Lincoln

Robert M Russ, Jr

Joseph Michael Ranish

Aaron Muir Hunter

Alexander N Lerner

Blake R Koelmel

Khurshed Sorabji

Todd J Egan

Jacob Newman

Izya Kremerman

Helder T Lee

Ayan Majumdar

Sanjay Rajaram

William W Bassett

Sangram Patil

Thomas L Webster

David K Carlson

Joseph Yudovsky

Stephen Moffatt

Son Truong Nguyen

Ming Xu

Dmitry A Dzilno

James Matthew Holden

Murali K Narasimhan

Kailash Kiran Patalay

Travis Morey

Karuppasamy Muthukamatchi

Alex Minkovich

Dinesh Kanawade

Patrick Pannese

Eran Weiss

Chandrakant M Sapkale

Schubert S Chu

Majeed Foad

Eric Andrew Englhardt

Andreas G Hegedus

Yoram Uziel

Paul Zachary Wirth

Nyi O Myo

Vinay K Shah

Steven Victor Sansoni

Leon Volfovski

Edward W Budiarto

Michael C Kuchar

John William Lane

Mariusch Gregor

Amitabh Puri

John Joseph Mazzocco

Andrew J Constant

Aaron Webb

John Bischof

Igor Krivts (Krayvitz)

Jeff Hudgens

Zvi Goren

Charles A Glorioso

Efrain Quiles

Adam Brailove

Miriam Schwartz

Penchala N Kankanala

Robert Irwin Decottignies

Songjae Lee

Robert A Borgeson

Rami Elichai

Gary J Rosen

Robert C Cook

Amulya Ligorio Athayde

Keith Brian Porthouse

Hongbin Li

Robin C Armstrong

Jack Francis Hammons

John Hulbert

Albert Mariasin

Raechel Chu-Hui Tan

Michael Thomas Haag

Karuppasamy Muthukamtchi

Brendan Till

Steve Szudarski

Andrew Scott Cornelius

Peter Irwin

Disclosed herein are embodiments of a sensor device, systems incorporating the same, and methods of fabricating the same. In one embodiment, a sensor device comprises a free-standing sensing element, such as a micro-electromechanical system (MEMS) device. The sensor device further comprises a metallic band to facilitate mounting the MEMS device to a mounting plate. The sensor device further comprises a conformal coating on a least a portion of a sensor region of the sensor device.

Micro-electromechanical device for use in a flow control apparatus

A substrate processing system includes a factory interface having a controlled environment and a transfer chamber. The transfer chamber includes four first facets and three second facets, where each of the three second facets has a width that is narrower than that of each of the four first facets. A first processing chamber is attached to one of the four first facets. A first auxiliary chamber is attached to a first of the three second facets, where the first auxiliary chamber is smaller than the first processing chamber. A load lock is attached to a second of the three second facets and to the factory interface. A robot is attached to a bottom of the transfer chamber, the robot adapted to transfer substrates to and from the first processing chamber, the first auxiliary chamber, and the load lock.

Semiconductor processing tool platform configuration with reduced footprint

Disclosed herein are embodiments of a mass flow control apparatus, systems incorporating the same, and methods using the same. In one embodiment, a mass flow control apparatus comprises a flow modulating valve configured to modulate gas flow in a gas flow channel, a sensor device, such as a micro-electromechanical (MEMS) device, configured to generate a signal responsive to a condition of the gas flow, and a processing device operatively coupled to the flow modulating valve and the sensor device to control the flow modulating valve based on a signal received from the sensor device.

Mass flow control based on micro-electromechanical devices

Disclosed is a wafer processing system, a dual gate system, and methods for operating these systems. The dual gate system may have a shaft, a first gate and a second gate coupled to the shaft at opposite sides thereof, and an actuator coupled to the shaft. The actuator is configured to tilt together the shaft, the first gate, and the second gate to a first sealed gate position or to a second sealed gate position. The actuator can be operated using a pneumatic mechanism, an electro-magnetic mechanism, or a cam follower mechanism.

Dual actuating tilting slit valve

Electronic device processing assemblies including an EFEM with at least one side storage pod attached thereto. The side storage pod has a side storage pod container. A supply conduit extends between an upper plenum of the EFEM to the side storage pod container. A fan causes purge gas to simultaneously flow into the EFEM chamber and into the side storage pod container. The fan also causes recirculation of the purge gas from the EFEM chamber. Methods of operating EFEMs and EFEMs are also disclosed.

Side storage pods, equipment front end modules, and methods for operating equipment front end modules

Electronic device processing systems including an equipment front end module (EFEM) with a side storage pod are described. The EFEM includes an EFEM chamber and a recirculation duct. The side storage pod is fluidly coupled to the recirculation duct. The side storage pod includes an interior chamber and a side storage container disposed within the interior chamber. The side storage container is configured to receive one or more substrates from the EFEM chamber. The electronic device processing system further includes an environmental control system. The environmental control system is configured to circulate a purge gas between the EFEM chamber and the side storage pod via the recirculation duct.

Side storage pods, equipment front end modules, and methods for operating EFEMs

Electronic device processing assemblies including an equipment front end module (EFEM) with at least one side storage pod attached thereto are described. The side storage pod has a side storage container. In some embodiments, an exhaust conduit extends between the chamber and a pod plenum that can contain a chemical filter proximate thereto. A supplemental fan may draw purge gas from the pod plenum through the chemical filter and route the gas through a return duct to an upper plenum of the EFEM. Methods and side storage pods in accordance with these and other embodiments are also disclosed.

Side storage pods, equipment front end modules, and methods for operating the same

Electronic device processing systems including environmental control of the factory interface are described. One electronic device processing system has a factory interface having a factory interface chamber, a load lock apparatus coupled to the factory interface, one or more substrate carriers coupled to the factory interface, and an environmental control system coupled to the factory interface and operational to monitor or control one of: relative humidity, temperature, an amount of oxygen, or an amount of inert gas within the factory interface chamber. In another aspect, purge of a carrier purge chamber within the factory interface chamber is provided. Methods for processing substrates are described, as are numerous other aspects.

Substrate processing systems, apparatus, and methods with factory interface environmental controls

Equipment front end module (EFEM) includes front located return ducts. The EFEM may include a front wall, a rear wall, and two side walls, the front wall including a plurality of load ports, and the rear wall configured to couple to a load lock apparatus. An EFEM chamber is formed between the front wall, the rear wall, and the two side walls. An upper plenum is positioned at a top of the EFEM and includes an opening into the EFEM chamber. Return ducts provide a return gas flow path enabling recirculation of gas from the EFEM chamber to the upper plenum. At least some of the plurality of return ducts are located between the load ports. Electronic device manufacturing assemblies and methods of operating equipment front end modules are also disclosed.

Front-ducted equipment front end modules, side storage pods, and methods of operating the same

A method and an integrated system. The integrated system can include an optical inspection unit, a charged particle device, an interface unit, and at least one controller.

Integrated system and method

A factory interface for an electronic device processing system includes a factory interface chamber, an inert gas supply conduit, an exhaust conduit and an inert gas recirculation system. The inert gas supply conduit supplies an inert gas into the factory interface chamber. The exhaust conduit exhausts the inert gas from the factory interface chamber. The inert gas recirculation system recirculates the inert gas exhausted from the factory interface chamber back into the factory interface chamber.

In some embodiments, a side storage pod apparatus of an equipment front end module (EFEM) includes a side storage enclosure having a surface configured to couple to a side wall of a body of the equipment front end module, and an opening configured to receive substrates from the equipment front end module. The EFEM further includes a side storage chamber within the side storage enclosure having a plurality of support members configured to support substrates thereon. The EFEM further includes a plenum chamber provided proximate the side storage chamber, the plenum chamber being a separate chamber from the side storage chamber and an exhaust port coupled to the plenum chamber.

High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods

Electronic device manufacturing apparatus and robot apparatus are described. The apparatus are configured to efficiently pick and place substrates wherein the robot apparatus includes an upper arm and three blades B, B, Bthat are independently rotatable. The three blades are configured to service a first dual load lock and second dual load lock wherein each dual load lock includes a different pitch. In some embodiments, a first pitch Pis smaller than a second pitch P. Blades Band B(or optionally blades Band B) can service the first dual load lock with Pitch Pand blades Band Bcan service the second dual load lock including the second pitch P. Methods of operating the electronic device manufacturing apparatus and the robot apparatus are provided, as are numerous other aspects.

Multi-blade robot apparatus, electronic device manufacturing apparatus, and methods adapted to transport multiple substrates in electronic device manufacturing

Electronic device processing systems including an equipment front end module with at least one side storage pod are described. The side storage pod has a side storage container and a container plenum. A fan draws purge gas from the equipment front end module chamber into the container plenum where the purge gas is directed into the side storage container to pass over substrates stored therein and is then exhausted back into the equipment front end module chamber. Methods and systems are also disclosed.

Growing community of inventors

Mountain View, CA, United States of America

Nir Merry