Broadcom Corporation

Nir Matalon

Sam Ziqun Zhao

Sumant Ranganathan

Victor Fong

Fan Yeung

A multimode DSL (digital subscriber line) line driver circuit is disclosed. The line driver circuit includes a switch network that enables the line driver circuit to be switched between multiple DSL communication configurations. Upon receipt of a mode control signal, the line driver circuit switches from a first DSL communication configuration to a second communication configuration. A DSL communication signal configured according to the second DSL communication configuration is received at the line driver circuit. The received DSL communication signal is amplified and/or filtered by the line driver circuit. The received DSL communication signal is transmitted from the line driver circuit. In one example implementation, the line driver circuit may be switched from an asymmetric digital subscriber line (ADSL) configuration to a very high speed digital subscriber line (VDSL) configuration, and may be switched from the VDSL configuration to the ADSL configuration.

Multimode DSL line driver

A differential amplifier with surge protection is described. The differential amplifier includes a first output driver device, a second output driver device, a first replica device, a second replica device, a current comparator, and a clamp circuit. The first replica device is configured to be a replica of the first output driver device. The second replica device is configured to be a replica of the second output driver device. The current comparator is configured to generate a threshold current, and to compare the threshold current to a first current through the first replica device and a second current through the second replica device. The clamp circuit is configured to limit a third current through the first output driver device and a fourth current through the second output driver device if the current comparator determines that the threshold current is greater than the first current or the second current.

Closed loop surge protection technique for differential amplifiers

Methods, systems, and apparatuses for integrated circuit packages and lead frames are provided. A quad flat no-lead (QFN) package includes a plurality of peripherally positioned pins, a die-attach paddle, an integrated circuit die, and an encapsulating material. The die-attach paddle is positioned within a periphery formed by the pins. The die is attached to the die-attach paddle. The encapsulating material encapsulates the die on the die-attach paddle, encapsulates bond wires connected between the die and the pins, and fills a space between the pins and the die-attach paddle. One or more of the pins are extended. An extended pin may be elongated, L shaped, T shaped, or 'wishbone' shaped. The extended pin(s) enable wire bonding of additional ground, power, and I/O (input/output) pads of the die in a manner that does not significantly increase QFN package cost.

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Sunnyvale, CA, United States of America

Nir Matalon