Hon Hai Precision Industry Co., Ltd.

Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.

Ning-Yu Wang

Zhi-Jiang Yao

Li-Fu Xu

Zhi-Guo Zhang

Guo-He Huang

Yu-Ling Jiang

A method for controlling a fan speed is disclosed. The fan cools a CPU in a computer. The method includes defining a CPU-max-temp value of a CPU, such that the first fan speed is linearly enhanced with the increase of a real temperature value of the CPU, when the real temperature value of the CPU is lower than the CPU-max-temp value, and changing the CPU-max-temp value to a higher CPU-max-temp value in a basic input output system. A second fan speed is linearly enhanced with an increase of the real temperature value, when the real temperature value is lower than the higher CPU-max-temp value. The second fan speed is less than the first fan speed at the real temperature value.

Method for controlling fan speed

A heat sink assembly includes an air duct, a heat sink and a fan. The air duct defines an air guiding channel therein. The heat sink is configured to contact a heat source to dissipate heat from a heat source. The heat sink includes a plurality of heat pipes. The heat sink is placed on one side of the air guiding channel, and the heat pipes contacts the air duct to transmit heat to the air duct. The fan is placed on the other side of the air guiding channel to communicate with the heat sink via the air duct. The fan forces air to flow through the air guiding channel to the heat sink to dissipate heat on the air duct and the heat sink.

Heat sink assembly including a heat pipe and a duct

A computer enclosure includes a chassis, a heat dissipation fan, a first duct, and a second duct. The chassis includes a bottom panel with a heat generating component and a side panel a vent defined therein. The first duct is attached between a first side of the fan and the vent of the chassis. The second duct is attached to a second side of the fan and covers the heat generating component. The second duct includes a resilient latch structure latchably secured to the second side of the fan.

Computer enclosure with heat dissipating assembly

A heat sink apparatus for dissipating heat generated from a heat generating component includes a first heat dissipating assembly attached to one side of the heat generating component, a second heat dissipating assembly attached to another side of the heat generating component; and a connecting device connecting between the first heat dissipating assembly and the second heat dissipating assembly thereby forming a continuous heat dissipation passage between the first heat dissipating assembly and the second heat dissipating assembly.

Heat sink apparatus

A heat sink includes a plurality of fins parallel to each other. The fins include a top portion having a flange. The opposite ends of each flange are rounded. Two rounded corners are located below the plane defined by the flange.

Heat sink

A heat dissipating system includes a chassis (), and a fan (). The chassis includes a rear plate (). The rear plate has an inner surface. The fan is secured to the rear plate inside the chassis. A distance is formed between the fan and the inner surface of the rear plate.

Heat dissipating system

A heat dissipation device includes a heat sink () and a fan (). The heat sink includes a plurality of fins (), and a guiding portion () is formed in the fins. The fan is secured to the heat sink. An airflow (F) is generated by the fan for flowing through the heat sink. When the airflow meets with the guiding portion, the airflow is deflected. The deflected airflow is guided to flow across heat-generating elements.

Heat dissipation device

A heat dissipation device () includes a base plate (), a fin assembly (), at least one heat pipe (), and a pair of foot members () attached to the base plate. The base plate defines a top surface (). At least one first channel () is defined in the top surface. The fin assembly has a first bottom surface (). At least one second channel () is defined in the first bottom surface corresponding to the at least one first channel. At least one indented portion () is defined in the first bottom surface. The at least one heat pipe is received in the first channel and the second channel, and attached through the fin assembly. At least one foot member is attached to the at least one indented portion of the fin assembly.

A fan speed controlling system for a power supply comprises a fan having two pins and a voltage comparator connected to the fan. The voltage comparator comprises a first input terminal for receiving a first reference voltage controlled by an external temperature of the power supply and a second input terminal for receiving a second reference voltage controlled by an interior temperature of the power supply. The voltage comparator outputs a higher voltage of the first and second reference voltage to the fan via the two pins.

Growing community of inventors

Shenzhen, China

Ning-Yu Wang