Sandisk Technologies Inc.

Western Digital Technologies, Inc.

Sandisk Corporation

Asml Netherlands B.v.

Sandisk Information Technology (shanghai) Co., Ltd.

Sandisk Semiconductor (shanghai) Co. Ltd.

Ning Ye

Hem P Takiar

Bo Yang

Cheemen Yu

Yangming Liu

Chih-Chin Liao

Chin-Tien Chiu

Jian Zhang

Suresh Kumar Upadhyayula

Jack Chang Chien

Robert C Miller

Michael J McCarthy

Shrikar Bhagath

Yixiang Wang

Naveen Kini

Jun Jiang

Shenghua Huang

Andre McKenzie

Venkatesh Ramachandra

Vinayak Ashok Ghatawade

Warren Middlekauff

Gokul Kumar

Chun Sean Lau

Michael Mostovoy

Zhongli Ji

King Hoo Ong

Ong King Hoo

Java Zhu

Hedan Zhang

Deepanshu Dutta

Tong Zhang

Li Ping Wang

Antony Ajan

Sarath Chandran Puthenthermadam

Cheeman Yu

Navneeth Kankani

Zhong Lu

Cong Zhang

Kumar Srinivasan

Chin Tien Chiu

Weili Wang

Zhiwen Kang

Fen Yu

Kim Lee Bock

Peng Chen

Chih-Yu Jen

Yanjun Xia

Shankara Venkatraman Gopalan

Enyong Tai

Bret Dee Winkler

Yuang Zhang

Dean M Jenkins

Peng Fu

Bret Winkler

Lihwa Fong

Pradeep Kumar Rai

Shiqiang Sun

Robertito Piaduche

Chih Chin Liao

Chaolun Zheng

Sung Tan Shih

Wei Wu

Yuhang Yang

Ahmad Faridzul Hilmi Shamsuddin

Sean Lau

DanJing Huang

Bin-Da Chan

A charged particle beam system may include a primary source, a secondary source, and a controller. The primary source may be configured to emit a charged particle beam along an optical axis onto a region of a sample. The secondary source may be configured to irradiate the region of the sample. The controller may be configured to control the charged particle beam system to change a parameter of an output of the secondary source. A method of imaging may include emitting a charged particle beam onto a region of a sample, irradiating the region of the sample with a secondary source, and changing a parameter of an output of the secondary source. A method of detecting defects may include inspecting a sample, generating a first defect distribution, and generating a second defect distribution.

Photo-electrical evolution defect inspection

A snap fit bracket for a capacitor slideably couples the capacitor to an opening defined by a substrate. The snap fit bracket includes four sidewalls that form a perimeter. The perimeter defines an opening into which the capacitor is horizontally positioned. A first channel is provided on a first side of the snap fit bracket and a second channel is provided on a second side of the snap fit bracket. Each of the first channel and the second channel are slideably coupled to respective edges within the opening of the substrate. A snap fit fastener is included in one or both of the first channel and the second channel. A portion of the snap fit fastener is received into a notch that is provided within the opening of the substrate which secures the snap fit bracket to the substrate.

Snap fit bracket for electrolytic capacitors

A system and a method for manipulating a beam of an Advanced Charge Controller module in different planes in an e-beam system are provided. Some embodiments of the system include a lens system configured to manipulate a beam in the tangential plane and the sagittal plane such that the beam spot is projected onto the wafer with high luminous energy. Some embodiments of the system include a lens system comprising at least two cylindrical lens.

Beam manipulation of advanced charge controller module in a charged particle system

A method of forming a semiconductor device includes forming vertical contact fingers in a substrate having side portions that are flexible. Contact fingers are formed near one or more edges of the flexible side portions of the substrate. After semiconductor dies are mounted to and electrically coupled to the substrate, the semiconductor device may be encapsulated by placing the device in a mold chase including upper and lower mold plates. The lower mold plate is sized smaller than the substrate so that the flexible side portions of the substrate including the contact fingers fold vertically upward to fit within the mold.

Method of forming a semiconductor device including vertical contact fingers

Apparatuses, systems, and methods for providing beams for controlling charges on a sample surface of charged particle beam system. In some embodiments, a module comprising a laser source configured to emit a beam. The beam may illuminate an area adjacent to a pixel on a wafer to indirectly heat the pixel to mitigate a cause of a direct photon-induced effect at the pixel. An electron beam tool configured to detect a defect in the pixel, wherein the defect is induced by the indirect heating of the pixel.

Thermal-aided inspection by advanced charge controller module in a charged particle system

A system and a method for monitoring a beam in an inspection system are provided. The system includes an image sensor configured to collect a sequence of images of a beam spot of a beam formed on a surface, each image of the sequence of images having been collected at a different exposure time of the image sensor, and a controller configured to combine the sequence of images to obtain a beam profile of the beam.

Method and apparatus for monitoring beam profile and power

A data storage device including, in one implementation, a number of memory die packages disposed on a substrate within the data storage device. Each memory die package has a die density that includes one or more memory dies. The die density of each memory die package is configured to provide an even thermal distribution across the number of memory die packages. The respective die densities of two memory of the die packages are different from each other.

Power reallocation for memory device

A semiconductor device includes a substrate, semiconductor dies on the substrate, molding compound and a reinforcing layer suspended within the molding compound. The reinforcing layer may for example be a copper foil formed in the molding compound over the semiconductor dies during the compression molding process. The reinforcing layer may have a structural rigidity which provides additional strength to the semiconductor device. The reinforcing layer may also be formed of a thermal conductor to draw heat away from a controller die within the semiconductor device.

Semiconductor device including a suspended reinforcing layer and method of manufacturing same

Methods and apparatus for detecting a failed temperature sensor within a data storage device and for mitigating the loss of the sensor are provided. One such data storage device includes a non-volatile memory (NVM), a set of temperature sensors, and a processor coupled to the NVM and the temperature sensors. The processor is configured to detect failure of one of the temperature sensors and obtain temperature data from the other temperature sensors. The processor is further configured to estimate, based on the obtained temperature data, the temperature at the failed sensor, and then control at least one function of the data storage device based on the estimated temperature, such as controlling entry into a Read Only mode. In some examples, the processor estimates the temperature at the failed sensor or at various virtual sensor locations using pre-determined formulas having offsets and coefficients determined during an initial machine learning calibration procedure.

Failed temperature sensor detection and mitigation within data storage devices

A protective enclosure for a PCB assembly, e.g., a solid-state-drive assembly. In an example embodiment, the enclosure comprises a flexible, stamped-metal heat spreader connected, by way of cured-liquid TIM parts, to at least some of the packaged integrated circuits on one side of the PCB assembly. In some embodiments, additional cured-liquid TIM parts may be connected between the body of the protective enclosure and packaged integrated circuits on the other side of the PCB assembly and/or the assembly's PCB. The PCB assembly, heat spreader, and various TIM parts are arranged in a manner that helps to significantly lower the risk of solder-joint failure under thermal cycling.

Protective enclosure for an electronic device

A data storage device includes an enclosure and a Printed Circuit Board Assembly (PCBA) extending in a basal plane, and a plurality of semiconductor memory packages electromechanically bonded to the PCBA and coupled to the enclosure with thermal interface material. The data storage device further includes a first fitting coupled to a first end of the PCBA and the enclosure, restricting movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane. The data storage device further includes a second fitting coupled to a second end of the PCBA, allowing movement of the PCBA in the basal plane with respect to the enclosure and restricting movement of the PCBA out of the basal plane.

Enclosure fitting for electronic device

The present disclosure generally relates to a flip chip assembly having a bump that reduces stress levels in a low-k dielectric layer in the flip chip. Rather than having a single, large area plateau that interfaces with a large corresponding opening of an insulating layer in the flip chip, the bump includes a plurality of much smaller pillars that interface with a corresponding plurality of openings in the insulating layer. In so doing, the low-k layer within the flip chip experiences much less stress and hence, fewer failures.

Flip chip bump with multi-PI opening

A semiconductor device package includes a substrate having a top planar surface and a first semiconductor die electrically connected to the top planar surface of the substrate. The first semiconductor die and substrate define a tunnel and a first molding compound encapsulates the first semiconductor die and fills the tunnel. A second molding compound that is separate and distinct from the first molding compound is mounted on a top surface of the first molding compound. The first molding, when in a flowable state, has a viscosity that is lower than a viscosity of the second molding compound when it is in a flowable state.

Semiconductor device package having multi-layer molding compound and method

Disclosed herein is an electronic device that includes a pedestal that extends from a mounting surface of a base of the electronic device. The electronic device also includes a thermal interface material that is interposed between an interface surface of the pedestal and a data processing component, is in direct contact with the data processing component, and is in direct contact with a first portion and a second portion of the interface surface. The first portion of the interface surface of the pedestal has a first height, relative to the mounting surface of the base, and the second portion of the interface surface of the pedestal has a second height, relative to the mounting surface of the base and different than the first height.

Electronic device with heat transfer pedestal having optimized interface surface and associated methods

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San Jose, CA, United States of America

Ning Ye