Realsee (beijing) Technology Co., Ltd.

Capital Normal University

Beijing Waiteksin Advanced Technology Co., Ltd.

Chongqing Normal University

Realsee Technology Co., Ltd.

Ning Tao

Mingyuan Wang

Yonglin Yang

Xun Wang

Zhi Zeng

Yutong Chen

Chengfeng Huang

Cunlin Zhang

Lichun Feng

A method for capturing an image of a scene using an imaging device is disclosed herein. The method includes determining a coordinate system with an origin based on an initial position of the imaging device, generating a first condition to control the position of the imaging device in the coordinated system with respect to the origin, generating a second condition to control the orientation of the imaging device, determining a position and an orientation of the imaging device, generating a first prompt message in response to the position of the imaging device satisfying the first condition, and generating a second prompt message in response to the orientation of the imaging device satisfying the second condition.

Method and device for collecting images of a scene for generating virtual reality data

Systems and methods for constructing a three-dimensional panorama model of an object are disclosed. An exemplary system includes a storage device configured to receive a plurality of point clouds each acquired at a different view angle. Each point cloud includes three-dimensional positions of a plurality of target points on a surface of the object. The system further includes at least one processor configured to determine elevation and normal at each target point in each point cloud and convert the elevation of each target point to color information. The at least one processor is further configured to register every two adjacent point clouds among the plurality of point clouds based on the three-dimensional positions, the normal, and the color information of the respective target points of the two adjacent point clouds. The at least one processor is also configured to render the three-dimensional panorama model based on the registered point clouds.

Systems and methods for constructing 3D panaroma model

A method for measuring thickness or defect depth by pulsed infrared thermal wave technology is described. The method includes heating a measured object by pulsed heating devices, and at the same time, obtaining a thermal image sequence on the surface of the measured object by an infrared thermography device, and storing the thermal image sequence in a general-purpose memory. The method also includes multiplying a temperature-time curve at every point of the thermal image sequence by a corresponding time, thereby obtaining a new curve. The method also includes calculating a first-order differential and obtaining a peak time thereof. The method also includes use of one or more formulas to thereby determine the thickness or the defect depth of the measured object.

Method for measuring thickness by pulsed infrared thermal wave technology

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Beijing, China

Ning Tao