Hon Hai Precision Industry Co., Ltd.

Hong-Fu Jin Precision Industry (Shenzhen) Co., Ltd.

Huawei Technologies Co., Limited

Zte Corporation

Shenzhen Circle-Dots Education Co., Ltd.

Shenzhen Manst Technology Co., Ltd.

Bgi Genomics Co., Limited

Bgi Health (Hk) Company Limited

Ning Li

Shou-Kuo Hsu

Xing Liu

Zheng Liu

Yong Zhang

Qing Wang

Xian-Xiu Tang

Chia-Nan Pai

Chia-Shin Chou

Hao Zeng

Dong Zhang

Qing Peng Wang

Xian-Guang Tan

Xi Yang

Zhitao Wang

Ming Yan

Han-Long Chen

Chiranjib Chakraborty

Huamin Luo

Jin Chai

Guishan Chen

Ye Yin

Wenqi Li

Tianxun Huang

Meifang Tang

Wurong Chen

Man Suo

Sujie Cao

Disclosed are coating equipment and a coating method. The coating equipment comprises a coating die and a slurry parameter detector. The coating die comprises a first slot, a second slot, a first adjusting mechanism and a second adjusting mechanism. Through the arrangement of the first adjusting mechanism and the second adjusting mechanism, adjustment of the flow rate of slurry circulating in the first slot and the second slot can be realized, and parameters of coated slurry are detected by a slurry parameter detector, and are then compared with preset values, and comparison results are fed back to the first adjusting mechanism and the second adjusting mechanism for adjustment of the first adjusting piece and the second adjusting piece, so that automatic adjustment of double-layer die coating is realized, the debugging effectiveness is greatly improved, and the coating efficiency is further improved.

Coating apparatus and coating method

The present disclosure relates to a virtual drum kit device. The virtual drum kit device includes a motion capture device and a drum sound processing device separated from each other; where, the motion capture device includes at least two drumsticks, the drumstick including a first cover body, as well as a first battery, a first control printed circuit board assembly (PCBA) board and a vibration motor which are arranged in the first cover body, the first control PCBA board being connected to the battery and the vibration motor separately, and being capable of transmitting an RF signal to the drum sound processing device according to a motion instruction captured by the drumstick, the drum sound processing device includes a second cover body, as well as a second battery and a second control PCBA board which are arranged in the second cover body.

Virtual drum kit device

This application discloses a video recording apparatus and a video recording method. The video recording apparatus includes a first demultiplexer, configured to: separate program information, audio data, and video data from a transport stream; a marker, configured to: mark the separated audio data and the separated video data, and transmit a mixed stream to an encryption processor, where the mixed stream includes the program information, the marked audio data, and the marked video data; and the encryption processor, configured to: identify the marked audio data and the marked video data in the mixed stream, encrypt the identified audio data and the identified video data to obtain encrypted audio data and encrypted video data, and transmit the encrypted audio data, the encrypted video data, and the program information to a memory in a rich execution environment REE for storage, so as to implement video recording.

Video recording method and video recording apparatus

In a method for adjusting a fan of an electronic device, a sensor of the electronic device detects an instant work environment temperature of an electronic component of the electronic device. The detected temperature is obtained from the sensor. The speed of the fan under the detected temperature and a speed of the fan to which it may be adjusted is computed using a predefined algorithm based on prestored values, obtained from experimentation. The fan is adjusted to achieve a heat dissipation mode and an energy-saving mode of the electronic device accordingly.

Electronic device and method for adjusting fan of electronic device

A computer enclosure includes a sidewall and a fan mounting apparatus. The sidewall defines a ventilation area and four slide slots around the ventilation area. The fan mounting apparatus includes two opposite first position member, and two opposite second position members alternately arranged with the first position members. The first and second position members are slidably connected end to end and cooperatively define a ring. The first and second position plates are moved toward or away from each other. The first and second position members are slidably and respectively connected to the slide slots, to decrease or increase a diameter of the ring for selectively mounting different sized fans.

Computer enclosure and fan mounting apparatus

A method and router for implementing mirroring, said method including: configuring a remote mirroring port on a source router, establishing a corresponding layer two virtual interface, and specifying a data stream requiring mirroring and a corresponding physical egress port; establishing a layer two virtual interface corresponding to the layer two virtual interface of said source router on a destination router; forming one VPWS tunnel between the layer two virtual interfaces of said source router and said destination router; filtering out the mirroring data stream from the packet received at the remote mirroring port of said source router, and sending obtained mirroring packet from the physical egress port on said source router to said destination router; searching the layer two virtual interface on said destination router after receiving mirroring packet, and sending mirroring packet without a label from its corresponding physical port to a monitoring port, thereby implementing router remote mirroring.

Method and router for implementing mirroring

A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.

Motherboard interconnection device

Growing community of inventors

Shenzhen, China

Ning Li