Olin Corporation

Gbc Metals, LLC

Nina Yukov

Derek E Tyler

Szuchain F Chen

Andrew Vacco

Julius C Fister

A James Brock

Lifun Lin

William L Brenneman

Chung-Yao Chao

Andrew J Vacco

James A Brock

Chen Szuchain

William L Brennemann

A composite material, comprising a carrier strip the carrier strip comprising a first side the first side comprising a substantially uniform roughness, an electrolytically deposited copper foil layer having opposing first and second sides and a thickness of from 0.1 micron to 15 microns and the entire metal foil layer thickness having been deposited from a copper containing alkaline electrolyte, and a release layer effective to facilitate separation of the metal foil layer from the carrier strip disposed between and contacting both the first side of the carrier strip and the second side of the metal foil layer.

Copper foil with low profile bond enhancement

A composite material includes a structural carrier layer and a relatively thin metal foil layer separated by a release layer. The release layer, that may be an admixture of a metal such as nickel or chromium and a non-metal such as chromium oxide, nickel oxide, chromium phosphate or nickel phosphate, provides a peel strength for the metal foil layer from the carrier strip that is typically on the order of 0.1 pound per inch to 2 pounds per inch. This provides sufficient adhesion to prevent premature separation of the metal foil layer from the carrier layer, but easy removal of the carrier layer when desired. Typically, the metal foil layer is subsequently bonded to a dielectric and the carrier layer then removed. The metal foil layer is then imaged into circuit features in the manufacture of printed circuit boards and flexible circuits.

Copper foil composite including a release layer

There it is disclosed a chemical treatment for copper foil which imparts a dark brown to black color to the foil and improves the bond strength of the foil to a dielectric substrate without detrimentally changing the etching characteristics of the foil. The treatment includes depositing a nodular copper/nickel alloy layer on a surface of the foil. These nodules are 55% to 95% by weight copper and are electrolytically deposited using a pulse power controller.

Nodular copper/nickel alloy treatment for copper foil

There is provided a method of treating a copper or copper alloy substrate to provide improved resistance to both oxidation and to chemical attack. The substrate is immersed in an aqueous solution containing both chromium (VI) ion and phosphate ions. The treatment is particularly effective for protecting imaged printed circuit boards during storage, handling and use.

Protective coating having adhesion improving characteristics

A technique for improving the tarnish and oxidation resistance of copper and copper based ally material is disclosed. The material is electrolytically coated by immersion in an aqueous electrolyte containing sodium hydroxide, zinc ions and chromium (VI) ions. The deposited coating is a codeposited layer of zinc and chromium with a zinc to chromium ratio of from about 5:1 to about 12:1. The coating provides tarnish resistance at temperatures in excess of 190.degree. C. and is removable by immersion in sulfuric acid.

Chromium-zinc anti-tarnish coating for copper foil

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Orange, CT, United States of America

Nina Yukov