Robert Boschgmbh

Nils Kummer

Jiri Marek

Roland Mueller-Fiedler

Guenther Findler

Klaus Breitschwerdt

Martin Willmann

Andre Mueller

Andreas Kern

Frauke Driewer

A method is proposed for producing three-dimensional structures, especially microlenses, in a substrate using an etching process, at least one original shape having a known original surface shape being present initially on the substrate in a plurality of places. The etching process has at least one first etching removal rate a and a second etching removal rate a which are material-dependent, and of which at least one is changeable as a function of time. The original shape is converted to a target shape by the etching process, the original surface shape of the original shape and the target surface shape of the target shape to be reached being known before the beginning of the etching process. In order to achieve the target surface shape, at least one of the etching rates a or a is set by a change of at least one etching parameter calculated before the beginning of the etching process as a function of the etching time.

Method for producing three-dimensional structures by means of an etching process

Device for one-sided etching of a semiconductor wafer

Growing community of inventors

Ludwigsburg, Germany

Nils Kummer