Applied Materials, Inc.

Nilesh Chimanrao Bagul

Prerna Sonthalia Goradia

Robert Jan Visser

Ranga Rao Arnepalli

Bahubali S Upadhye

Visweswaren Sivaramakrishnan

Abhijit Basu Mallick

Pramit Manna

Subramanya P Herle

Sumedh Acharya

Tapash Chakraborty

Mahendran Chidambaram

Nitin Deepak

Darshan Thakare

Hemantha Raju

Mahesh Arcot

Ravindra Patil

Dakshalkumar Patel

Sankesha Bhoyar

Girish Kumar Chaturvedi

Vicente M Lim

Basavaraj Pattanshetty

Ajay More

Marco Mohr

Bjoern Sticksel-Weis

Exemplary methods of removing lithium-containing deposits may include heating a surface of a lithium-containing deposit. The surface may include oxygen or nitrogen, and the lithium-containing deposit may be disposed on a surface of a processing chamber. The methods may include contacting the surface of the lithium-containing deposit with a hydrogen-containing precursor. The contacting may hydrogenate the surface of the lithium-containing deposit. The methods may include contacting the lithium-containing deposit with a nitrogen-containing precursor to form volatile byproducts. The methods may include exhausting the volatile byproducts of the lithium-containing deposit from the processing chamber.

Cleaning materials and processes for lithium processing equipment

Methods for etching alkali metal compounds are disclosed. Some embodiments of the disclosure expose an alkali metal compound to an alcohol to form a volatile metal alkoxide. Some embodiments of the disclosure expose an alkali metal compound to a β-diketone to form a volatile alkali metal β-diketonate compound. Some embodiments of the disclosure are performed in-situ after a deposition process. Some embodiments of the disclosure provide methods which selectively etch alkali metal compounds.

Etching of alkali metal compounds

An additive manufacturing apparatus includes a platform, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform, at least one energy source to selectively fuse feed material in a layer on the platform, and an air knife assembly. The air knife assembly includes an inlet unit to deliver gas over the platform and an exhaust unit to receive gas from over the platform. The inlet unit includes a multi-chamber plenum, a gas inlet, and a gas distribution module. The multi-chamber plenum has a plurality of vertically stacked chambers that are fluidically connected, with a first chamber of the plurality of vertically stacked chambers positioned at a higher elevation than a collection chamber of the plurality of vertically stacked chambers.

Air knife inlet and exhaust for additive manufacturing

An additive manufacturing apparatus includes an environmentally sealed first chamber, a second chamber separated from the first chamber by a first valve, a platform positionable in the first chamber, a dispenser configured to deliver a plurality of successive layers of feed material onto the platform in the first chamber, at least one energy source to selectively fuse feed material in a layer on the platform in the first chamber, and an air knife assembly to direct a laminar flow of air across a layer of feed material on the platform in the first chamber. The air knife assembly includes an inlet module and an exhaust module that are movable through the first valve between the first chamber and the second chamber.

Air knife assembly for additive manufacturing

Systems for prequalifying components for a processing chamber are described. The systems may be used to clean particulates from chamber parts and concurrently quantify the cleanliness. The systems may be used to qualify replacement parts before sending to a customer site for installation. The systems have three adjacent compartments separated by impermeable barriers. All three compartments are filled with liquid while cleaning a chamber component. The center compartment contains a submerged component for cleaning and qualifying. Two compartments on either side of the center compartment are configured with submerged ultrasonic transducers to deliver ultrasonic energy to either side of the component being cleaned and prequalified. A liquid pump is connected to the cleaning tub to recirculate water from the cleaning bath and another liquid pump is configured to remove a small amount of the cleaning bath to sample particulates.

Methods and systems for liquid particle prequalification

An apparatus for direct liquid injection (DLI) of chemical precursors into a processing chamber is provided. The apparatus includes a vaporizer assembly having an injection valve for receiving a liquid reactant, vaporizing the liquid reactant, and delivering the vaporized liquid reactant. The injection valve includes a valve body encompassing an interior region therein, a gas inlet port, a liquid inlet port, and a vapor outlet port all in fluid communication with the interior region. The vaporizer assembly further includes a first inlet line having a first end fluidly coupled with the liquid inlet port and a second end to be connected to a liquid source. The vaporizer assembly further includes a second inlet line with a first end fluidly coupled with the gas inlet port, a second end fluidly coupled with a carrier gas source, and a heater positioned between the first end and the second end.

Direct liquid injection system for thin film deposition

Systems and methods for forming films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a liquid solution made from a solvent and a deposition precursor. A carrier gas may be flowed through the liquid solution and push the droplets toward a substrate placed in a substrate processing region. The droplets pass into the substrate processing region and chemically react with the substrate to form films. The temperature of the substrate may be maintained below the boiling temperature of the solvent during film formation. The solvent imparts a flowability to the forming film and enable the depositing film to flow along the surface of a patterned substrate during formation prior to solidifying. The flowable film results in bottom-up gapfill inside narrow high-aspect ratio gaps in the patterned substrate.

Flowable gapfill using solvents

Systems and methods for processing films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a condensed matter (liquid or solid) of one or more precursors. A carrier gas is flowed through the condensed matter and push the droplets toward a substrate placed in a substrate processing region. An inline pump connected with the aerosol generator can also be used to push the droplets towards the substrate. A direct current (DC) electric field is applied between two conducting plates configured to pass the droplets in-between. The size of the droplets is desirably reduced by application of the DC electric field. After passing through the DC electric field, the droplets pass into the substrate processing region and chemically react with the substrate to deposit or etch films.

Low vapor pressure aerosol-assisted CVD

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Bengaluru, India

Nilesh Chimanrao Bagul