At&s (china) Co. Ltd.

Nikolaus Bauer-Öppinger

Wilhelm Tamm

Yucun Dou

ZhaoJian Chen

Sally Sun

Yee-Bing Ling

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure. Furthermore, a bore extends into the layer stack and has a first bore section with a first diameter (D) and a connected second bore section with a second diameter (D) differing from the first diameter (D). A thermally conductive material fills substantially the entire bore. The bore is in particular formed by laser drilling.

Component carrier comprising a copper filled multiple-diameter laser drilled bore

A component carrier includes a layer stack formed of an electrically insulating structure and an electrically conductive structure with a bore extending into the layer stack. The bore includes a first bore section with a first diameter and a connected second bore section with a second diameter differing from the first diameter. The component carrier further comprises a thermally conductive material filling substantially the entire bore. The bore is in particular formed by mechanical drilling.

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Gramastetten, Austria

Nikolaus Bauer-Öppinger