Arizona State University

Purdue Research Foundation

Nikhilesh Chawla

Bruno Azeredo

Kenan Song

Aliaksandr Sharstniou

Stanislau Niauzorau

Amm G Hasib

Natalya Kublik

Sridhar Niverty

Martha A Dudek

James C E Mertens

Jason J Williams

James E Mertens

A method of making a metal-polymer composite includes dealloying metallic powder to yield porous metal particles, monitoring a temperature of the mixture, controlling the rate of combining, a maximum temperature of the mixture, or both, and combining the porous metal particles with a polymer to yield a composite. Dealloying includes combining the metallic powder with an etchant to yield a mixture. A metal-polymer composite includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a thermoplastic or thermoset polymer. The polymer composite comprises at least 10 vol % of the porous metal particles. A powder mixture includes porous metal particles having an average particle size of about 0.2 μm to about 500 μm and a metal powder. The powder mixture includes about 1 wt % to about 99 wt % of the porous metal particles.

Synthesis of nanoscale metal feedstock for additive manufacturing

Systems and fixtures for mounting, under mechanical constraint, wire-like or fiber-like samples of a high aspect ratio and down to 100 micrometers in diameter are disclosed. A region of interest along the length of the sample resides between and beyond a mechanical constraint on either side, allowing access to the region of interest for a wide number of characterization probes. The fixture may provide electrical isolation between two retaining blocks by means of a dielectric support member. The design may achieve minimal thermal expansion along the length of the sample by the material selection for the dielectric support member. Electrical contact may be introduced to the sample through conductive constraints in the retaining blocks. The fixture may have a minimal size perpendicular to the length axis of the sample to facilitate high probe fluxes when a diverging probe is used. The fixture may provide high x-ray transparency between the retaining blocks. The systems and fixtures as described therefore may provide a means for performing electrical and thermal testing on samples, including but not limited to solder butt-joints, across multimodal in situ characterization and imaging techniques to analyze dynamic electromigration.

Fixture for in situ electromigration testing during X-ray microtomography

A modular X-ray computed tomography (XCT) system having a higher degree of modularity provides experimental versatility and in situ capabilities. The modular XCT system includes interchangeable X-ray sources and detectors that allow for the XCT system to be readily adapted to different imaging tasks, such as those that may require different trade-offs between spatial resolution, exposure time, power, and other scanning parameters.

Modular high resolution X-ray computed tomography system

A lead free solder consisting of a ternary eutectic composition of Sn-3.9Ag-0.7Cu with Ce in the amount of 0.5 to 2% by weight exhibits improved oxidation resistance increased ductility in comparison with other RE metals and is characterized by a homogeneous mixture of large grain CeSnintermetallics in a Sn beta phase. In solder applications, the joints with the solder are resistance to interfacial fracture by distributing the strain within the solder interface increasing impact resistance.

Oxidation resistant Pb-free solder alloys

Growing community of inventors

Tempe, AZ, United States of America

Nikhilesh Chawla