National Semiconductor Corporation

Intersil Americas Inc.

Nikhil Vishwanath Kelkar

Viraj Ajit Patwardhan

Hem P Takiar

Pai-Hsiang Kao

Jian Yin

Loyde Milton Carpenter, Jr

William Jeffrey Schaefer

Jaime A Bayan

Luu Thanh Nguyen

Ken Pham

Hau Thanh Nguyen

Cheol Hyun Han

Ashok S Prabhu

Lynn Karl Wiese

Michael W Althar

Francois Hebert

Ranjan J Mathew

Inderjit Singh

Young-Gon Kim

Sadanand R Patil

David B Bell

Nattorn Pongratananukul

Steven R Rivet

Mark Harrison Baker

Louis Elliott Pflughaupt

Patrick J Selby

Lian Hee Tan

Zaki Moussaoui

Anindya Poddar

Shahram Mostafazadeh

Kai Chieh Liu

Randolph Cruz

You Chye How

Stephen Gee

Neeraj Anil Pendse

Christopher G Quentin

Tian Oon Goh

Sagar Pushpala

Soi Chong Low

Vivek Kishorechand Arora

John A Jackson

Seshasayee sS Ankireddi

King Tong Lim

A Tharumalingam Sri Ganesh

A circuit module includes a plurality of electronic components and a single-layer conductive package substrate. The single-layer conductive package substrate is adapted to physically support and electrically interconnect the electronic components. The substrate has a peripheral portion and an interior portion. The peripheral portion includes a plurality of peripheral contact pads coupled to corresponding electronic components. The interior portion includes a plurality of floating contact pads that are electrically isolated from the peripheral contact pads and are coupled to corresponding electronic components.

Method of fabricating a circuit module

An embodiment of a power-supply module includes a package having sides, a first power-supply component disposed in the package, and an electromagnetic-interference (EMI) shield disposed adjacent to two sides of the package. For example, such a module may include component-mounting platforms (e.g., a lead frame or printed circuit board) on the top and bottom sides of the module, and these platforms may provide a level of EMI shielding specified for a particular application. Consequently, such a module may provide better EMI shielding than modules with shielding along only one side (e.g., the bottom) of the module. Moreover, if the module components are mounted to, or otherwise thermally coupled to, the shielding platforms, then the module may provide multi-side cooling of the components.

Power supply module with electromagnetic-interference (EMI) shielding, cooling, or both shielding and cooling, along two or more sides

Circuit module such as a high-density lead frame array (HDA) power module, and method of making same

Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the plane defined by the lead frame, adjacent to the lead frame, and electrically coupled to the lead frame, the laminate substrate having a first surface including a second plurality of exposed terminals and a second surface opposite the first surface; a first one or more dies mounted on the lead frame and electrically coupled to the lead frame; and a second one or more dies mounted on the second surface of the laminate substrate and electrically coupled to the laminate substrate.

Packaged circuit with a lead frame and laminate substrate

An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.

Stacked inductor-electronic package assembly and technique for manufacturing same

Method of manufacturing a packaged circuit including a lead frame and a laminate substrate

Embodiments of a leadframe for a device packaging are used not only for structural support and connectivity to the I/O pins to the external world, but also for housing and/or mounting devices above and below the leadframe. Being electrically conductive, the leadframe also serves as a low resistance interconnect and good current carrier between the bondpads on one device or between the bondpads on different devices above and/or below the leadframe.

Package leadframe for dual side assembly

A packaged semiconductor device includes at least first and second lead-fingers. A molded structure forms a cavity and is molded around portions of each of the first and second lead-fingers to thereby mechanically attach each of the first and second lead-fingers to the molded structure. A semiconductor structure (e.g., a IC, chip or die) is attached within the cavity. First and second bond wires respectively providing electrical connections between the semiconductor structure and the first and second lead-fingers. A further portion of each of the first and second lead-fingers is mechanically attached to a bottom surface of the semiconductor structure to inhibit relative mechanical motion between the semiconductor structure, the molded structure and the first and second lead-fingers.

Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems

A method for attaching antennae to RFID tags is disclosed. Included is the use of RFID tags having asymmetrical interconnect system for one or more antennae, such that virtually any rotational orientation of the RFID tag will result in a successful antennae attachment. Two oversized and 'L' shaped gold-bumped holes can be arranged on the same side of the ship in an opposing action, such that at least one axis of symmetry is formed. Accordingly, virtually all rotational orientations of the chip are then acceptable when attaching a pair of opposing pole antenna leads. Alternatively, a pair of poles can be located on opposing chips surfaces, such that antenna substrates can be attached to both the top and bottom of the chip to form a product 'sandwich', whereby the rotational orientation of the chip is irrelevant at an antenna attachment step.

Methods for manufacturing a radio frequency identification tag without aligning the chip and antenna

A semiconductor device is provided and includes a semiconductor die, and a plurality of bond pads having exposed surfaces arranged in an alternating interleaved pattern on the semiconductor die. Each of the surfaces of the bond pads have a first bond placement area that overlaps with a second bond placement area, with the first bond placement area having a major axis that is orthogonal to a major axis of the second bond placement area. A connecting bond is located at an intersection of the major axes of the first bond placement area and the second bond placement area on one or more of the bond pads.

Bond pad configurations for semiconductor dies

A power converter can include an output circuit having a high-side device and a low-side device which can be formed on a single die (a 'PowerDie'). The power converter can further include a controller integrated circuit (IC) formed on a different die which can be electrically coupled to, and co-packaged with, the PowerDie. The PowerDie can be attached to a die pad of a leadframe, and the controller IC die can be attached to an active surface of the first die such that the first die is interposed between the controller IC die and the die pad.

Stacked power converter structure and method

A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issue associated therewith.

Leadframe structures for semiconductor packages

An optical sensor device, according to an embodiment of the present invention, includes a light source and a light detector. The light source includes one or more light emitting elements, and the light detector includes one or more light detecting elements. A first opaque light barrier portion, between the light source and the light detector, is configured to block light from being transmitted directly from the light source to the light detector. A second opaque light barrier portion, extending from the first opaque light barrier portion in a direction towards the light source, is configured to reduce an amount of specular reflections that would occur if a light transmissive cover plate were placed over the optical sensor device. A third opaque light barrier portion, extending from the first light barrier portion in a direction towards to the light detector, is configured to reduce an amount of specular reflections that would be detected by the light detector, if a light transmissive cover plate were placed over the optical sensor device.

Optical sensors that reduce specular reflections

An optical sensor device comprises a light source, a light detector, and an opaque light barrier including a first portion to block light from being transmitted directly from the source to the detector. A second portion of the light barrier extends from the first portion in a direction towards the light source, such that a portion of the second portion covers at least a portion of light emitting element(s) of the source, to reduce an amount of specular reflections, if a light transmissive cover plate were placed over the sensor. Additionally, a third portion of the barrier can extend from the first portion, in a direction towards to the detector, such that a portion of the third portion covers at least a portion of light detecting element(s) of the detector, to reduce an amount of specular reflections that would be detected by the detecting element(s) of the detector, if a light transmissive cover plate were placed over the sensor. Additionally, an off-centered lens can cover a portion of the light source.

A conductive clip having a riser or post formed along a side thereof includes a notch or opening formed in the riser or post to create a first riser or post section and second riser or post section separated by the notch or opening through which a tiebar extends. The conductive clip organization is will suited for formation as elongated strips of such conductive clips for automated machine assembly of the conductive clips in an integrated circuit package context.

Tie-bar configuration for leadframe type carrier strips

Growing community of inventors

San Jose, CA, United States of America

Nikhil Vishwanath Kelkar