E.i. Dupont De Nemours and Company

Nigel Morton Coe

Charles D Lang

Matthew Stainer

Johann T Trujillo

Stephen Sorich

Kyle D Frischknecht

Raymond S Pflanzer

Nageswara Rao Tadepalli

There is provided herein a process for forming an encapsulated electronic device. The device has active areas and sealing areas on a substrate. The process includes providing the substrate; forming a discontinuous pattern of a material having a first surface energy on at least a portion of the sealing areas; forming multiple active layers, where at least one active layer is formed by liquid deposition from a liquid medium having a surface energy greater than the first surface energy; providing an encapsulation assembly; and bonding the encapsulation assembly to the substrate in the sealing areas. Also provided are devices formed by the disclosed processes.

Process for forming encapsulated electronic devices

There is provided an essentially planar test substrate for non-contact printing. The substrate has a first layer having a first surface energy and having a planar measurement portion. A liquid containment pattern is over at least the measurement portion of the first layer. The liquid containment pattern has a second surface energy that is different from the first surface energy. The measurement portion of the first layer and the liquid containment pattern together are substantially planar.

Planar test substrate for non-contact printing

Organic electronic devices that include dummy electrodes are described, along with methods for using such devices.

Organic electronic device and processes for forming and using the same

An organic electronic device includes a first member including: a substrate; a first conductive layer formed on the substrate; an organic active layer deposited on a portion of the first conductive layer; and a second conductive layer deposited on the organic active layer and on the first conductive layer; and a second member coupled to the first member to form an enclosed space, the second member including: a lid; and a third conductive layer deposited on the lid, wherein the third conductive layer is electrically coupled to one or both of the first and the second conductive layers.

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Santa Barbara, CA, United States of America

Nigel Morton Coe